I. Tsurin's personal development review
             in period from mid 2010 to mid 2011

Main achievement
----------------
TCAD modelling of the implantation technology and advising
e2v company upon the ion energy and dose and the moderator
thickness for manufacturing planar silicon strip detectors
for the Atlas upgrade. The new sensors (run 10242) hold now
1kV that's well above their full depletion voltage.

Mask design (primary role)
--------------------------
a.) Large-area planar silicon strip detector for the ATLAS
    SCT upgrade (wafer is being manufactured by e2v)
b.) RD-50 multi-project wafer (being manufactured by Micron)
c.) IBL pixel wafer with single and double sensor tiles (wafers
    produced by Micron Semiconductor in "n-in-p", "n-in-n" and
    "p-in-n" technologies, all sensors have been evaluated and
    shipped to Fraunhofer IZM for bump-bonding)
d.) IBL wafer with single, double and quad sensors tiles
    (submitted to Micron Semiconductor)
e.) Medipix multi-project wafer

Telescope design and construction (valuable task)
-------------------------------------------------
a.) construction of mechanical frame and support structures
b.) design and evaluation of the cooling system based on the
    Peltier element
c.) Design of 12-channel temperature monitor with the USB
    interface
d.) Firmware development for the front-end control and readout
e.) Firmware development for data routing and logging
f.) Software development for the ISEG HV control

Evaluation of LiF-coated silicon sensors for
neutron detection (research and development)
--------------------------------------------
a.) Assembly of data acquisition system based on (designed
     earlier) multi-channel analyzer
b.) System calibrating using generator pulses and beta source
c.) Measurements with the neutron source:
     sensors with thick LiF coating on the implant side
     sensors with thin  LiF coating on the implant side
     sensors with       LiF coating on the backplane
     sensors without        coating

Atlas IBL project
-----------------
Assembly and calibration of pixel modules for the beam test
at CERN scheduled for July 2010 (canceled) and October 2010.
Taking part in the beam test shifts.

Conferences
-----------
"Pixel 2010" in September 2011 in Switzerland with presentation:
"Characterization of "n-in-p" pixel sensors for high radiation
environments". Proceedings published in NIM A 650 pp. 140-144.

Teaching support
---------------------
Assisting PhD student (Dean Forshaw), master student (Adrian
Pritchard) and bachelor student (Edward Burke) in the laboratory.

Routine measurements
--------------------
a.) IC(V) scans and charge collection efficiency measurements
    of newly fabricated and irradiated detectors.
b.) Regular radiation background monitoring in the clean room
    in areas G11, G13 and G14.

Mechanics design and preparation
--------------------------------
a.) Adapter for the probe station for measurements of double-sided
    wafers (wafer support and sliding backplane contact)
b.) High voltage interlocks for all freezers and probe stations in
    the clean room (safety measures)
c.)"Device under test" box with a coincidence scintillation trigger.
e.) Lead sarcophagus for radioactive sources

Equipment repairs
-----------------
a.) ISEG SHQ 222 high voltage unit (fixing burned AC-DC converter)
b.) Keithley 2410 high voltage unit (attempt to repair, paperwork
    for refurbishment at Keithley service centre).
c.) Atlas Pixel DAQ (overheating power regulators, burned cable
    drivers)
d.) 2x Polycom phone conference stations

Different
---------
Evaluation of new material for Tim Greenshaw: measurement of the
air flow resistivity of porous silicon carbide as a function of
the gas pressure. Low-mass silicon carbide is a perspective material
for the sensor support and cooling structures.


ToDo list
---------
a.) Development of user interface for the telescope, taking data with
    proton and muon beams at CERN (September - October 2011)
b.) Conference on imaging and vertex detectors to present automation
    in the mask design: scripting and parametric cell approaches for
    preparation of masks, extraction rules for the rule checker and
    process modeling for manufacturing.
c.) IDESA school on chip design in sub-micron technologies.
d.) Participation in the LHeC design proposal.