Job description:
---------------
Circuit Dimension 60mm x 60mm
Base material: Pyralux AP8545R
Total copper thickness after plating (each side) - 35um
Minimum drill diameter 200 um
Minimum track/gap      100um
ENIG finish for aluminium wire bonding
Flexible solder resist on top
Pyralux HXC1215 coverlay on the bottom (no openings for plated holes T01)
Silkscreen print on top side

Layer map:
---------
pixflex_rd53_hirose.drd	Drill chart
pixflex_rd53_hirose.top	Top copper
pixflex_rd53_hirose.bot	Bottom copper
pixflex_rd53_hirose.smt	Top solder mask
pixflex_rd53_hirose.sst	Top silkscreen print
pixflex_rd53_hirose.dim	Board dimension

pixflex_rd53_hirose.spt  Top solder paste stencil 

Drills used:
-----------
 T01   0.2mm   236	plated
 T02   1.0mm     8	non plated
 T03   2.0mm     1      non plated
 T04   3.0mm     6	non plated








 Code  Size       used

 T01   0.0079inch   253
 T02   0.0394inch     7
 T03   0.1181inch     6

Total number of drills: 266

Plotfiles:

 C:/Users/tsurin/Documents/eagle/PixFlex_v4/Gerber/Do/pixflex_rd53_2xJAE.drd