Development of the BST pad system

"Pad hybrid design."

Every detector module consists of a silicon sensor (32 pads on a common substrate) and a small printed circuit board (hybrid) with the readout chip. The hybrid contains a number of capacitive filters for the ASIC supply voltages and RC-filters for the threshold and depletion voltages. There were some capacitors on the hybrid prototype foreseen to stabilize the chip bias voltages. In the final design these components were omitted without degrading the chip performance. The trigger pulse width was reduced from 80 ns to 50 ns with an external resistor, drawing an additional bias current.
  The calibration circuitry provides a double MIP signal for the test input of the readout chip. This signal is a short current pulse generated on the motherboard and transmitted to the hybrid via the stripline. The pulse is terminated on the hybrid (to match the characteristic impedance of the stripline), converted to the voltage, attenuated and transformed into the charge. The hybrid circuit diagram and the board layout were created in the "OrCad" v.9.1 development system. All hybrids passed electrical tests before and after the ASIC mounting and after the silicon sensor assembly.

Pad hybrid (2X zooming)