silk screen graphics for component ID
solder mask 60um photo coverlay
M1 - traces, bond pads, SMD component pads 15 um
copper 3um nickel w gold flash
50um kapton
M2 - traces 15um copper estimate
100um kapton
M3 - ground plane 15um copper estimate
50um kapton
M4 - power plane - not complete over whole board.
complete isolating layer 60um photo coverlay
discrete component attach is by soldering
circuit will be bonded to carbon fibre substrate using epoxy after component attachment
NEW Copper
coverage estimates for radiation length calculation
There is negligible copper inside a radius of 6cm (fingers to connect
bias only)
From 6cm to 8cm the coverage is approximately M1 10%
M2 10% M3 100% M4 95%
from 8cm to 10cm the coverage is approximately M1 30% M2 5%
M3 100% M4 10%
Note that the hybrid is rectangular 17.5* 12.1 cm and the ground plane
extends over the whole area
except within the 6cm radius from the centre of the beam. These estimates
are made as the proportion of metal
coverage in the part of the annuli within the rectangular outline of
the hybrid..
Production files ( gerber RS274x)
silk screen top side
solder resist top side
top side metal,
metal 2.
metal 3 ground plane,
metal 4 power plane
drill locations
Drill file in excellon format Drill file drill report
mechanical drawing of carbon fibre substrate
mechanical drawing of kapton circuit
More info : design
overview
Postscript views of hybrid layers silkscreen
top side solder resist top sidetop
metal 1 metal 2metal
3 ground plane metal 4 power plane