The
work of this group falls into two distinct areas, tests on individual
components and tests on these components as a subsystem in a full system.
Components
The
individual components comprise
1)
VECSELS
2)
PIN Diodes
3)
DORIC Chips
4)
VDC Chips
5)
Fibres
6)
Opto Package
7)
Plug-in Assembly (plug-in)
Items 1) – 6) have already been evaluated extensively by the links group as individual components and, for the purposes of the PRR, it is thought that references can simply be made to this work.
At
the time of the PRR, it is likely that there will not yet have been a final
decision on which of the two possible options (GEC or Taiwan) for item 6), the
Opto package, will be used, but information will be available for both options.
Note
that the active components will be the same in both and that the difference is
essentially one of different package design and assembly techniques.
Item
7) the plug in assembly is the only component that is unique to the forward
modules.
The final form of this will depend on the
final choice of opto package. The difference between the two types is simply
that, should the Taiwan package be chosen, because this already uses a PCB
substrate to mount the active components, then it may be possible to attach the
connector directly to this PCB rather than use an additional separate PCB as is
required with the GEC package.
******* New one piece plug-ins produced in Taiwan.
Essentially
the function and performance would be identical but the complexity and size
would be reduced.
Prototypes
of the plug-in have been assembled and are undergoing tests in the system test
with more being assembled into a harness.
It
was decided that the plug-n was a sufficiently different component to the bare
Opto package that a sample should be irradiated with gammas and neutrons and
its performance evaluated. N.B.the heavy metal content of the connector (brass
nickel, gold), PCB (copper) and solder, mean that it is not possible to use the
reactor facility at Ljubljana if we ever want them back. AW will contact Alex Grillo to see if this
is possible in California.
====>>>
ACTION AW - irradiate at least
one plug-in for early Feb 01
******* ARRANGED FOR Taiwan packages END OF FEB
Already
have test results from GEC packages on Barrel dogleg
Do not intend to repeat for
forward. --- is this OK?
Performance
as a subsystem.
1)
Basic
function testing
2)
Bit
Error Rate (BER)
3)
Crosstalk
(Xtalk)
4)
Thermal
5)
Mechanical
and handling
Item
1) basic function testing, is essentially a check that the opto subsystem when
implemented on the hybrid is able to drive the front-end chips after
irradiation. As the hybrids can be driven electrically through the bypass
inputs and read out via the spy outputs, it should be simple to identify any
differences in performance attributable to the optical subsystem. Irradiated
modules are now available to allow these tests to be made. However, whilst
there were DORIC and VDC chips glued to the module during the irradiation they
were not bonded and therefore not powered at the time. It was felt that,
although for completeness it would have been preferable that the chips be
powered, the results from individual irradiations of the components would be
sufficient to make this unnecessary.
====>>>
ACTION TS check opto and electrical performance are the same – ongoing in
system test – will chase cumulative experience over next 2 months
******** No problems reported so far
Items
2) and 3) Bit error rate and crosstalk are standard test applied to the opto
subsystem and data is available from the links group on individual components.
The main difference between the forward and barrel implementations of the opto
subsystems is that the forward has a slightly longer electrical path length and
is thus slightly more prone to noise pickup and crosstalk. Tests on non
irradiated, early versions of forward hybrids showed that the performance was within the specification
for both tests. These tests will now be repeated with the irradiated modules.
=====>>> ACTION - AW, PWP, BER and Xtalk tests on irradiated
module on RAL test setup - next few weeks
******** NOT DONE AW contacted
– will set up
Item
4) Thermal performance. As the forward opto parts are mounted on the hybrid the
temperature of these is directly dependent on the overall thermal performance
of the hybrid. There are component lifetime considerations here. A thermal
analysis was originally done some time ago, however since then there have been
a number of changes made to the hybrid design, and the power dissipation
estimates of the front end chips have risen. It is clear that this analysis
must be redone and actual measurements made for the PRR
=====>>> ACTION - TS, Tim Jones -- calculation
-
JP, Tim Jones -- thermal camera measurements?? in the next few weeks
-
********* Some preliminary camera
measurements done. Camera not in systest any more.
Item
5) Mechanical. performance. The opto plug-in and fibres are small and fiddly
and we need to verify that it is possible to safely handle, attach and dismount
them, assess the likelihood of failure and iterate the design as necessary.
======>>>ACTION
- JP will collect experience from system test over next 3 months
********* ONGOING
INFORMATION EXCHANGE - TS will set up web
page to point to relevant material.
********* NOT DONE