N.A.Smith

Link to files relating to -forward on disk services
                                   grounding and shielding
                                   opto PCB files
                                   K4 version of wiggly kapton for support card interconnect
                                   Test card for K4 version wiggly kaptons   testk4.cwk 21 * 17 cm double sided different resist each side with silk screen top side only
                                               This can be viewed using GC-PREVUE
                                               you can download GC-PREVIEW (use version 7) free from
                                               http://www.pcb-pool.com/html_uk/uk_service_1.htm They can also make you a PCB from this file.

*************************************************************************************

Production files for 'wiggly' interconnect kaptons

K4 version April 01

topside solder resist gerber file
top side metal gerber file
bottom side metal gerber file
bottom side solder resist gerber file
drill file

K3 version
bottom side solder resist .lgr .ps
bottom side copper .lgr .ps
top side copper .lgr .ps
top side solder resist .lgr .ps
drill file
view of cable from top side .ps showing top and bottom side copper superposed.
connector details - text file
connector details - word doc file

Partial schematics of opto-on-board hybrid showing connector detail on hybrid - single sheet (rev 1.2)optcon1.ps

blow up of top half (rev1.1)optcon1a.ps blow up of bottom half(rev1.1)optcon1b.ps

Support card info and connector details can be found on the melbourne web page http://www.ph.unimelb.edu.au/epp/projects/fwdopto

drawing of opto connections on barrel dogleg for reference barrelop.ps

link to GEC opto assy dimensioned drawing pdf Drawing of forward opto PCB module .PS

spreadsheet of radiation length contributions (.xls)

bonding diagram for abcd2 .ps bonding diagram for DORIC and LDC chips .ps
bonds to fanout from hybrid TOP SIDE .ps BOTTOM SIDE .ps

**************************************************************************************
Ground scheme on forward hybrids gndschem.ps ,

opto chips on forward hybrid

LAYER IMAGES IN POSTSCRIPT FORMAT (version 4)
substrate drawing (ps)
file names indicate layers and are of the form a4(layer name) - the layer name is starts with either a t or b for top or bottom side print.
The next letter is the type of layer i = insulator; v = via fill; m = metal( conductor layer) the first print layer on each side is a via fill and this is numbered 0 - eg a4tv0.xxx is the top side via fill for through holes.
The layers are arranged in this list in the order that they would appear if the finished hybrid were sectioned and looked at end on.
The first column of numbers indicates the possible sequence of printing to avoid bowing of the substrate

17 a4tm4.ps ,     top side metal 4 - solderable metal layer for component attachment ( also used for solder paste printing)
16 a4tv3-4.ps ,   top side via fill for connection from metal 3 trace layer to metal 4 solder layer
15 a4ti3-4n.ps,   top side final insulator over top layer metal 3 traces and isolates them from metal 4 solder layer and chip substrates
14 a4tm3.ps ,     top side metal 3 ( needs to be wire bondable gold)
13 a4tv2-3.ps ,   top side via fill for connections between top side metal 2 and metal 3
11 a4ti2-3n.ps,   top side insulator between top side metal 2 and metal 3
9    a4tm2.ps ,     top side metal 2 (mostly a solid plane layer - no wire bonds)
7    a4tv1-2.ps ,   top side via fill for connections between top side metal 1 and metal 2
5    a4ti1-2n.ps,   top side insulator between top side metal 1 and metal 2
3    a4tm1.ps ,     top side metal 1 conductor layer ( mostly a solid plane layer - no wire bonds)
1    a4tv0.ps ,      top side via fill for through holes
                          -------500um beryllia ceramic substrate---------
2    a4bv0.ps ,     bottom side via fill for through holes - essentially a mirror of top side via fill
4    a4bm1.ps ,    bottom side metal 1 ( traces but no wire bonds required)
6    a4bi1-2n.ps, bottom side insulator between bottom side metal 1 and metal 2
8    a4bv1-2.ps , bottom side via fill between bottom side metal 1 and metal 2
10 a4bm2.ps ,     bottom side metal 2 ( needs to be wire bondable gold)
12    a4bi2-3n.ps, bottom side insulator over botom side final metal layer

a4t-ovly.ps, top side discrete component overlay - note there are no discrete components on the bottom side of this design

PS files of print layers (note - via pads do not print in ps files )

substrate outline for opto on board - updated version 4 with 2 off 1.8mm holes afwds04.ps, afwds04.dxf afwds04.drl

LAYER IMAGES IN autocad (DXF) FORMAT (version 4)
a4tv0.dxf , a4tm1.dxf , a4ti1-2n.dxf, a4tv1-2.dxf , a4tm2.dxf , a4ti2-3n.dxf, a4tv2-3.dxf , a4tm3.dxf , a4ti3-4n.dxf, a4tv3-4.dxf , a4tm4.dxf , a4t-ovly.dxf, a4bv0.dxf , a4bm1.dxf , a4bi1-2n.dxf, a4bv1-2.dxf , a4bm2.dxf , a4bi2-3n.dxf,
GERBER PLOT FILES, (version 4)
a4tv0.lgr , a4tm1.lgr , a4ti1-2n.lgr, a4tv1-2.lgr , a4tm2.lgr , a4ti2-3n.lgr, a4tv2-3.lgr , a4tm3.lgr , a4ti3-4n.lgr, a4tv3-4.lgr , a4tm4.lgr ,
a4t-ovly.lgr, a4bv0.lgr , a4bm1.lgr , a4bi1-2n.lgr, a4bv1-2.lgr , a4bm2.lgr , a4bi2-3n.lgr,

auxiliary files
a4aperts.txt ,aperture list a4part.txt ,parts list for abcd a4build2.txt ,hybrid construction a4popln.ps , component overlay

Partial schematics of opto-on-board hybrid (version 4)
single sheet (rev 1.2)optcon1.ps blow up of top half optcon1a.ps blow up of bottom half)optcon1b.ps

*************************************************************************************************************************

bpmenc2.ps , Bi_phase mark encoder for support card v2- working document - for discussion only

Files associated with a proposal to mount opto chips on the forward hybrids with the PIN diode and VECSEL optical components mounted in a separate electrically pluggable package.

Outline of main points optoshrt.ps, More detail optolong.ps

3D construction drawing of pluggable opto module optoassy.ps,

Opto chip on board-- preliminary plots

Preliminary schematic of opto module, opto chips and power tape connections to forward hybrid optosch.ps,

Preliminary placement of opto chips on underside of hybrid opchipvu.ps,

Pinouts of ldc and doric chips. ldcdoric.ps,

Top side view of hybrid showing opto module and connector placement opconplc.ps,

Plug-in opto pcb and adapter for bit error rate tests using barrel pigtail kapton optopcb1.dxf,dxf file.

optopcb1.ps,ps version showing 2 layer boards with and without ground plane areas for clarity.

********************************************************

info posted before summer '98

- adapter cable for linking forward hybrids to barrel support cards

fwdadapt.ps,file showing adapter cable, barrel support card and forward module.

Liverpool end-tap ABC/ABCD Forward Hybrids Version 1a

OLD Hybrid, proposed forward opto and power cable pin assignments. The pin assignments here are designed so that the interconnecting, two-layer, kapton cable can be made without crossovers or the need for plating through. This will allow this cable to be made from two layers of aluminium on kapton.

OLDtopology.ps, side view of connectors and cables to a forward module

OLDpower.ps, pin assignment and trace topology of kapton

OLDpwrcon.ps, enlarged view of power tape connections

OLDhybcon.ps, enlarged view of hybrid connector

OLDoptocon.ps, enlarged view of opto connector

Files for ceramic substrate production

(version 1a)

afwds02.ps, dimensioned drawing of substrate

afwds02.drl, text file of small hole co-ordinates

afwds02.dxf, autocad drawing of substrate

LAYER IMAGES IN DXF FORMAT

(version 1a)

a2tv0.dxf , a2tm1.dxf , a2ti1-2n.dxf, a2ti1-2a.dxf, a2ti1-2b.dxf, a2tv1-2.dxf , a2tm2.dxf , a2ti2-3n.dxf, a2tv2-3.dxf , a2tm3.dxf , a2ti3-4n.dxf, a2tv3-4.dxf , a2tm4.dxf , a2t-ovly.dxf, a2bv0.dxf , a2bm1.dxf , a2bi1-2n.dxf, a2bv1-2.dxf , m a2bm2.dxf , a2bi2-3n.dxf, a2b-ovly.dxf,

abc1apcb.dxf, full pcb database image (7.4MB). To understand use of layer names see pltabc1a.mac, this is a text format macro file used for producing plots from the PCAD database and contains all the layer names, their use in the database and the groupings of layers for plot production There are many layers in the database other than those used for plot production, containing mechanical info, layer buildup etc. Please understand that this database file has evolved over time and several different pcb and hybrid designs so it contains information on some layers that may not be up to date or relevant.

LAYER IMAGES IN POSTSCRIPT FORMAT (version 1a)

a2tv0.ps , a2tm1.ps , a2ti1-2n.ps, a2ti1-2a.ps, a2ti1-2b.ps, a2tv1-2.ps , a2tm2.ps , a2ti2-3n.ps, a2tv2-3.ps , a2tm3.ps , a2ti3-4n.ps, a2tv3-4.ps , a2tm4.ps , a2t-ovly.ps, a2bv0.ps , a2bm1.ps , a2bi1-2n.ps, a2bv1-2.ps , m a2bm2.ps , a2bi2-3n.ps, a2b-ovly.ps,

discrete component list partabcd.txt ,

NEW NEW NEW ---- may '98

BONDING DIAGRAM FOR ABCD CHIPS

abcdbond.ps,

FORWARD HYBRID SCHEMATIC version 1 for version 1a hybrid ---

scha0.dxf, dxf file of full schematic which if plotted at A1 size will give readable text if the plot is good.

scha0.ps, postscript file of whole schematic - but too small to read unless you can enlarge it so there now follow 16 A4 size sheets which can be put together to form an A0 plot if you have no other option

scha4-1.ps, scha4-2.ps, scha4-3.ps, scha4-4.ps, scha4-5.ps, scha4-6.ps, scha4-7.ps, scha4-8.ps, scha4-9.ps, scha4-10.ps, scha4-11.ps, scha4-12.ps, scha4-13.ps, scha4-14.ps, scha4-15.ps, scha4-16.ps,

Next ABC/ABCD Forward Hybrids Version 3

subst3.ps, substrate outline - drawing NP27-03-116

NEXT FORWARD HYBRID _ PROVISIONAL PLOTS FOR DISCUSSION

newcool.ps,

original and proposed increased cooling contact area on forward hybrids.

NOTE that the new increased area is close to the maximum possible using the original V1 hybrid profile. This has been achieved by removing all diagnostic lines and removing the bus and resistors required for distribution of the CAFE current setting line. If these are required then this new contact area will have to be reduced.

kapton3.dxf, kapton3.ps,

REV3 possible kapton layout for opto board on the face of the wheel --- preliminary and incomplete.

abcdinnr.dxf, abcdinnr.ps, inner ring kapton ----preliminary and incomplete

last update march 31st 1998

Liverpool end-tap CDP Forward Hybrids

Some plots of the component overlay etc. of the cdp/lbic/cafe/hac forward hybrid. Note that the schematic and component assignments are essentially the same as the original Carl Haber barrel version A single sided version was also produced on alumina using only the top side plots.

comptop.ps,top side component layout

conn.ps,top side enlarged connector assignment

cdpbond.ps,bonding for cdp

hacbond.ps,bonding for hac

lbicbond.ps,bonding for lbic

Contact Information

E-Mail:: <smithy@hep.ph.liv.ac.uk>
Phone:: +44 151 794 3400
Fax:: +44 151 794 3444
Postal Address:: Department of Physics