minutes of Liverpool Pixel group meeting 6/8/2013

Present: S.Burdin, G.Casse, P.Dervan, D.Forshaw, H.Hayward.

 Main topic of discussion is preparation for the testbeam on August 12. 

 Dean: There are 7 devices which could be ready for the testbeam: 250x50, 2 500x25, 2 125x100, 2 2000x25. 
Some of them could be damaged due to removal of the dicing tape. There are 4 days at the testbeam. 
We can assume 1 day per device. The current plan is following:
250x50 (old) - 250x50 (new)
125x100      - 125x100
2000x25      - 2000x25
quad (unirradiated) - quad (irradiated 5x10^15). or 500x25 - 500x25 if the quad board doesn't work.

All the devices (except the reference one?) will be measured underdepleted, overdepleted, 
at 0 degrees and 15 degrees.

  The plan is to check the efficiency map, charge sharing and correlations with the punch through. 
A proper folding of the 2D efficiency map could be used.

 It would be useful to check why testbeam analysis software and see why the two DUTs are so closely connected.
In particular, TBMON masks out the bad regions based on the columnXrow dimensions (checkatline processor). 
We should be able to get the results without this fix though.

 Plans: 
   1) Have a meeting with Mike and Ilya after the testbeam and discuss design of the new board.
   2) Start preparation for the testbeam in November.
      a) schedule
      b) devices for tests

Peter Sutcliffe mentioned after the meeting that the quad+double quater-rings thermally bend 0.5mm. He is 
investigating the reason.