ALIBAVA - BEETLE Readout Daughter Board
Introduction
Preliminary overview document of the Daughter board can be found here. Daughter-Board Status report (PowerPoint or PDF). Printed Circuit Board (PCB) Manufacturing Information Gerber Photo Plots (RS-274-X format): · Component Layer1 · Internal Layer2 (Ground Plane, Negative) · Internal Layer3 (Power Plane, Negative) · Solder Layer4 · Solder Resist Top · Solder Resist Bottom · Legend Top · Legend Bottom [Right-Click and select "Save Link As..." to save the Gerber plots and then view with your preferred Gerber Viewer]. The PCB construction details are: · Multilayered, 4 layers, of FR4 type laminate with 1/2oz Cu (17um). · 1.6mm finished thickness. · Minimum track and gap is 100um (4 mil). · Board finish is Electroless Nickel/Immersion Gold (~0.1um Gold plated over ~5um Nickel underlay) - this technique is used to enable Al wire bonding to the PCB. Fan-In Information · Top layer of the PCB and ASIC locations detail (Gerber). Both layers in DXF format. · BEETLE bond pad information here (Beetle 1.5 layout is the device that will be used). Return to the Liverpool HEP Home page
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