ALIBAVA - BEETLE Readout Daughter Board

    


Introduction

Preliminary overview document of the Daughter board can be found here.

Daughter-Board Status report (PowerPoint or PDF).

 

Printed Circuit Board (PCB) Manufacturing Information

Gerber Photo Plots (RS-274-X format):

 

· Component Layer1

· Internal Layer2 (Ground Plane, Negative)

· Internal Layer3 (Power Plane, Negative)

· Solder Layer4

· Solder Resist Top

· Solder Resist Bottom

· Legend Top

· Legend Bottom

 

[Right-Click and select "Save Link As..." to save the Gerber plots and then view with your preferred Gerber Viewer].

 

The PCB construction details are:

 

· Multilayered, 4 layers, of FR4 type laminate with 1/2oz Cu (17um).

· 1.6mm finished thickness.

· Minimum track and gap is 100um (4 mil).

· Board finish is Electroless Nickel/Immersion Gold (~0.1um Gold plated over ~5um Nickel underlay) - this technique is used to enable Al wire bonding to the PCB.

 

Fan-In Information

 

· Top layer of the PCB and ASIC locations detail (Gerber). Both layers in DXF format.

· BEETLE bond pad information here (Beetle 1.5 layout is the device that will be used).

 

 

 

 

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For comments etc. please contact 
Ashley Greenall
Last modified: 20/03/2007