LHCb Velo - Module - 93
| Module |
Hybrid |
| Circuit |
Pitch Adaptors |
Chips |
Sensor |
|---|
|
42
R-glued |
93
| r-93 |
All ,
R1 |
All ,
0 ,
1 ,
2 ,
3 |
2440-14E |
|
| R2 |
4 ,
5 ,
6 ,
7 |
| R3 |
8 ,
9 ,
10 ,
11 |
| R4 |
12 ,
13 ,
14 ,
15 | |
| p-93 |
All ,
P1 |
All ,
0 ,
1 ,
2 ,
3 |
2439-05B |
|
| P2 |
4 ,
5 ,
6 ,
7 |
| P3 |
8 ,
9 ,
10 ,
11 |
| P4 |
12 ,
13 ,
14 ,
15 |
|
|
Go to
Current Hybrid Log Entry
Module-93 Logfile - STAGE 1 Entered by phil at 04:27:11 PM 19/06/06
-----------------
Module 93 entry added to data base. Associated with Substrate 67
Thickness Max 0.000 Min 0.000
Deviations A -0.103 / B 0.012 / C -0.171
r-side Hybrid circuit added.
p-side Hybrid circuit added.
Substrate link to module updated.
Visual Inspection Comment:
--------------------------
========================================================================
Module-93 Logfile - STAGE 2 Entered by rcarroll at 09:53:23 AM 20/06/06
--------------------------
Thickness measurements at chip locations
----------------------------------------
Thickness at chip pos 00 is 1.52
Thickness at chip pos 01 is 1.51
Thickness at chip pos 02 is 1.51
Thickness at chip pos 03 is 1.50
Thickness at chip pos 04 is 1.50
Thickness at chip pos 05 is 1.50
Thickness at chip pos 06 is 1.49
Thickness at chip pos 07 is 1.49
Thickness at chip pos 08 is 1.48
Thickness at chip pos 09 is 1.49
Thickness at chip pos 10 is 1.47
Thickness at chip pos 11 is 1.48
Thickness at chip pos 12 is 1.47
Thickness at chip pos 13 is 1.46
Thickness at chip pos 14 is 1.48
Thickness at chip pos 15 is 1.46
Average of thickness measurements at chip locations 1.488125
Thickness Measurement Comment:
------------------------------
========================================================================
Module-93 Logfile - STAGE 3 Entered by rcarroll at 04:37:07 PM 20/06/06
--------------------------
Phi and R side Metrology data:
-----------------------------
On arrival.
4th corner deviation -0.381
M93_p_height.CSV uploaded. Longitudinal Analysis
M93_r_height.CSV uploaded. Longitudinal Analysis
M93_r_twist.CSV uploaded. Height Analysis
========================================================================
Module-93 Logfile - STAGE 4 Entered by smithy at 05:11:46 PM 21/06/06
--------------------------
Module 93 sent for population updated to Stage 4
========================================================================
Module-93 Logfile - STAGE 5 Entered by smithy at 12:28:09 PM 29/06/06
--------------------------
Received after polpulation:
========================================================================
Module-93 Logfile - STAGE 5 Entered by geoff at 02:54:07 PM 3/07/06
--------------------------
Comments for hybrid cicuit electrical tests:
Module tested for electrical shorts - non found.
Electrical test of components PASSED
========================================================================
Module-93 Logfile - STAGE 6 Entered by geoff at 05:11:14 PM 3/07/06
--------------------------
Comments from visual inspection after population:
R side:-
Chip 5, Solder on Vdd pad.
Chip 7, Solder on Vss pad.
Chip D, Solder on Vdd & Vss pads.
Phi side:-
Chip B, Solder on Vdd pad.
========================================================================
Module-93 Logfile - STAGE 7 Entered by rcarroll at 09:49:39 AM 4/07/06
--------------------------
Phi and R side Metrology data:
-----------------------------
After population.
4th corner deviation -0.460
M93_p_height2.CSV uploaded. Longitudinal Analysis
M93_r_height2.CSV uploaded. Longitudinal Analysis
M93_r_twist2.CSV uploaded. Height Analysis
========================================================================
Authorisation - Entered by smithy at 10:54:09 AM 5/07/06
-------------
Authorisation given to proceed with PA and chip gluing
Module has been set as PASS
========================================================================
Module-93 Logfile - STAGE 8 Entered by affolder at 01:11:00 PM 10/07/06
--------------------------
Following R-type Pitch Adaptors glued
----------------------------------------
PA-133-R1
PA-136-R2
PA-133-R3
PA-136-R4
========================================================================
Module-93 Logfile - STAGE 9 Entered by mpw at 03:12:55 PM 13/07/06
--------------------------
Following P-type Pitch Adaptors glued
----------------------------------------
PA-136-P1
PA-109-P2
PA-95-P3
PA-97-P4
========================================================================
Module-93 Logfile - STAGE 10 Entered by mpw at 03:18:10 PM 13/07/06
---------------------------
Place R-side chips
Chip C1R3 position 0 on hybrid R-93 updated
Chip C-1R3 position 1 on hybrid R-93 updated
Chip C-3R4 position 2 on hybrid R-93 updated
Chip C-4R4 position 3 on hybrid R-93 updated
Chip C-3R3 position 4 on hybrid R-93 updated
Chip C-2R3 position 5 on hybrid R-93 updated
Chip C4R4 position 6 on hybrid R-93 updated
Chip C5R4 position 7 on hybrid R-93 updated
Chip C6R4 position 8 on hybrid R-93 updated
Chip C7R4 position 9 on hybrid R-93 updated
Chip C8R4 position 10 on hybrid R-93 updated
Chip C7R5 position 11 on hybrid R-93 updated
Chip C6R5 position 12 on hybrid R-93 updated
Chip C5R5 position 13 on hybrid R-93 updated
Chip C4R5 position 14 on hybrid R-93 updated
Chip C-4R6 position 15 on hybrid R-93 updated
========================================================================
Comment - Entered by gdp at 09:45:56 AM 14/07/06
-------
Phi side Chips have been transferred from H83 by hand and
progessed to next stage.
Hybrid manually progressed to next stage.
========================================================================
Module-83 Logfile - STAGE 11 Entered by mpw at 04:48:33 PM 13/07/06
---------------------------
Place P-side chips
Chip C-3R5 position 0 on hybrid P-83 updated
Chip C-1R5 position 1 on hybrid P-83 updated
Chip C3R5 position 2 on hybrid P-83 updated
Chip C-3R6 position 3 on hybrid P-83 updated
Chip C-1R6 position 4 on hybrid P-83 updated
Chip C0R6 position 5 on hybrid P-83 updated
Chip C1R6 position 6 on hybrid P-83 updated
Chip C2R6 position 7 on hybrid P-83 updated
Chip C3R6 position 8 on hybrid P-83 updated
Chip C5R6 position 9 on hybrid P-83 updated
Chip C6R6 position 10 on hybrid P-83 updated
Chip C7R6 position 11 on hybrid P-83 updated
Chip C-1R7 position 12 on hybrid P-83 updated
Chip C0R7 position 13 on hybrid P-83 updated
Chip C2R7 position 14 on hybrid P-83 updated
Chip C3R7 position 15 on hybrid P-83 updated
========================================================================
Module-93 Logfile - STAGE 12 Entered by jcw at 02:26:22 PM 20/07/06
--------------------------
Backend Bond r-side Comment:
----------------------------
Multiple attempts to bond 767, 815, 857.
Problems with following 12 bond wires:
__________________________________
Bond | Chip | RefNum | Pin Name |
----------------------------------
1 15 135 VddPre
2 15 136 VddPre
539 8 207 Vdda
538 8 207 Vdda
767 4 137 GndPre
768 4 138 GndPre
770 4 140 VddPre
815 4 207 Vdda
857 3 180 Reset
278 12 5 GndPre
277 12 1 GndPre
766 4 136 VddPre
========================================================================
Module-93 Logfile - STAGE 13 Entered by jcw at 04:35:52 PM 20/07/06
--------------------------
Backend Bond p-side Comment:
----------------------------
Problems with following 4 bond wires:
__________________________________
Bond | Chip | RefNum | Pin Name |
----------------------------------
1005 1 207 Vdda
1006 1 208 Icurrbuf
1007 1 209 Isf
51 15 206 VddaTx
========================================================================
Module-93 Logfile - STAGE 14 Entered by huse at 09:15:07 PM 25/07/06
--------------------------
Electrical Test Comment:
----------------------------
R Chips PASS
Phi Chips PASS
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.704 |
0.047 |
128.219 | 2.945
| | 1 |
0.708 |
0.049 |
131.830 | 2.402
| | 2 |
0.718 |
0.014 |
127.722 | 2.957
| | 3 |
0.731 |
0.015 |
126.420 | 2.419
| | 4 |
0.721 |
0.016 |
127.562 | 2.961
| | 5 |
0.719 |
0.015 |
126.073 | 1.615
| | 6 |
0.740 |
0.015 |
126.325 | 0.859
| | 7 |
0.740 |
0.014 |
128.954 | 1.890
| | 8 |
0.748 |
0.017 |
132.860 | 1.510
| | 9 |
0.736 |
0.021 |
126.329 | 3.605
| | 10 |
0.744 |
0.074 |
132.551 | 1.455
| | 11 |
0.734 |
0.077 |
130.521 | 2.518
| | 12 |
0.711 |
0.074 |
131.092 | 1.093
| | 13 |
0.655 |
0.060 |
129.121 | 1.112
| | 14 |
0.598 |
0.013 |
129.119 | 2.186
| | 15 |
0.602 |
0.018 |
131.810 | 1.293
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.713 |
0.063 |
127.895 | 2.213
| | 1 |
0.724 |
0.089 |
129.036 | 1.853
| | 2 |
0.708 |
0.014 |
129.277 | 2.674
| | 3 |
0.714 |
0.015 |
128.935 | 1.888
| | 4 |
0.712 |
0.017 |
130.924 | 1.812
| | 5 |
0.710 |
0.017 |
128.605 | 1.370
| | 6 |
0.739 |
0.015 |
130.679 | 2.513
| | 7 |
0.752 |
0.015 |
130.081 | 1.599
| | 8 |
0.734 |
0.019 |
128.967 | 2.221
| | 9 |
0.727 |
0.019 |
128.527 | 1.942
| | 10 |
0.759 |
0.118 |
133.258 | 0.870
| | 11 |
0.775 |
0.145 |
129.882 | 2.338
| | 12 |
0.688 |
0.069 |
126.103 | 1.133
| | 13 |
0.652 |
0.047 |
128.731 | 1.806
| | 14 |
0.607 |
0.017 |
130.064 | 1.383
| | 15 |
0.607 |
0.016 |
128.682 | 1.768
|
|
Module updated to Stage 16
========================================================================
Module-93 Logfile - STAGE 17
-------------------
Front end bonding (chip to pitch adaptor) on 710
r-side 710 Row 1 Entered by jcw at 03:26:30 PM 9/08/06
----------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL
r-side 710 Row 2 Entered by jcw at 03:29:39 PM 9/08/06
----------------
Bonding Stats: 511 OK / 1 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
2 15 3461 0 57 1 OK
r-side 710 Row 3 Entered by jcw at 03:30:20 PM 9/08/06
----------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL
r-side 710 Row 4 Entered by jcw at 02:58:45 PM 10/08/06
----------------
Bonding Stats: 509 OK / 3 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
4 21 3461 0 83 1 OK
4 143 3471 4 59 1 OK
4 322 3478 10 7 1 OK
r-side Front end bond complete. Database updated.
Module updated to Stage 17 complete
========================================================================
Module-93 Logfile - STAGE 18
-------------------
Front end bonding (chip to pitch adaptor) on 710
p-side 710 Row 1 Entered by jcw at 03:59:10 PM 11/08/06
----------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL
p-side 710 Row 2 Entered by jcw at 03:59:10 PM 11/08/06
----------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL
p-side 710 Row 3 Entered by jcw at 04:00:15 PM 11/08/06
----------------
Bonding Stats: 511 OK / 1 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
3 330 3504 10 38 1 OK
p-side 710 Row 4 Entered by jcw at 02:13:00 PM 14/08/06
----------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL
p-side Front end bond complete. Database updated.
Module updated to Stage 18 complete
========================================================================
Module-93 Logfile - STAGE 18A Entered by huse at 03:44:59 PM 4/09/06
--------------------------
Electrical Test Comment:
----------------------------
R Chips PASS
Phi Chips PASS
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.760 |
0.020 |
128.231 | 2.282
| | 1 |
0.791 |
0.020 |
132.849 | 2.559
| | 2 |
0.808 |
0.021 |
127.807 | 2.894
| | 3 |
0.832 |
0.018 |
126.550 | 2.456
| | 4 |
0.804 |
0.014 |
127.559 | 2.993
| | 5 |
0.834 |
0.024 |
126.112 | 1.587
| | 6 |
0.824 |
0.019 |
126.347 | 0.874
| | 7 |
0.900 |
0.030 |
129.024 | 1.895
| | 8 |
0.825 |
0.014 |
133.042 | 1.550
| | 9 |
0.855 |
0.016 |
126.452 | 3.598
| | 10 |
0.828 |
0.027 |
132.527 | 1.506
| | 11 |
0.901 |
0.040 |
130.419 | 2.524
| | 12 |
0.771 |
0.074 |
131.357 | 1.115
| | 13 |
0.745 |
0.072 |
129.307 | 1.097
| | 14 |
0.671 |
0.008 |
129.300 | 2.232
| | 15 |
0.792 |
0.032 |
132.101 | 1.352
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.802 |
0.094 |
128.145 | 2.186
| | 1 |
0.882 |
0.136 |
129.685 | 1.981
| | 2 |
0.794 |
0.018 |
129.418 | 2.632
| | 3 |
0.875 |
0.016 |
129.144 | 1.871
| | 4 |
0.789 |
0.018 |
131.093 | 1.810
| | 5 |
0.827 |
0.020 |
128.761 | 1.390
| | 6 |
0.823 |
0.018 |
130.807 | 2.491
| | 7 |
0.931 |
0.027 |
130.361 | 1.638
| | 8 |
0.795 |
0.009 |
129.125 | 2.229
| | 9 |
0.828 |
0.020 |
128.659 | 1.935
| | 10 |
0.879 |
0.093 |
133.473 | 0.864
| | 11 |
0.989 |
0.101 |
130.150 | 2.420
| | 12 |
0.745 |
0.071 |
126.254 | 1.127
| | 13 |
0.730 |
0.055 |
128.939 | 1.808
| | 14 |
0.659 |
0.016 |
130.286 | 1.398
| | 15 |
0.768 |
0.022 |
128.796 | 1.718
|
|
Module updated to Stage 18
========================================================================
Authorisation - Entered by affolder at 04:00:52 PM 4/09/06
-------------
Authorisation given to proceed with sensor gluing
Module has been set as PASS
========================================================================
Module-93 Logfile - STAGE 19 Entered by at 02:39:47 PM 5/09/06
--------------------------
Following r-type Sensor glued
-------------------------------
2440-14E attached to hybrid 93 - DB updated
Add Sensor Comment:
-------------------
========================================================================
Module-93 Logfile - STAGE 20 Entered by at 02:40:38 PM 5/09/06
--------------------------
Following p-type Sensor glued
-------------------------------
2439-05B attached to hybrid 93 - DB updated
Add Sensor Comment:
-------------------
========================================================================
Module-93 Logfile - STAGE 21 Entered by huse at 09:35:40 AM 6/09/06
----------------------------
Sensor-sensor Metrology Comment:
--------------------------------
Hyb93P.CSV uploaded.
Hyb93R.CSV uploaded.
Sensor alignment
Module updated to Stage 21
========================================================================
Comment - Entered by mwhitley at 04:38:32 PM 6/09/06
-------
When bonding the bias bonds on the Phi side I noticed that there is no glue under the pitch adaptor on P1
on each corner at the sensor end this will require infilling prior to sensor bonding.
========================================================================
Module-93 Logfile - STAGE 22 Entered by huse at 05:38:48 PM 6/09/06
----------------------------
Bias bond & IV Comment:
-----------------------
hyb93P_2439-05B_unbonded.txt uploaded. Plot Graphic
hyb93R_2440-14E_unbonded.txt uploaded. Plot Graphic
Module updated to Stage 22
========================================================================
Module-93 Logfile - STAGE 23
----------------------------
Sensor end bonding (sensor to pitch adaptor) on 710
r-side 710 Row 1 Entered by mpw at 02:01:53 PM 18/09/06
-------------------
Bonding Stats: 511 OK / 0 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
1 400 3481 12 63 -2 OK
1 359 3480 11 27 1 OK
1 503 3484 15 91 1 OK
1 506 3484 15 103 1 OK
Last 3 rows added by hand. GDP 18/09/06
r-side 710 Row 2 Entered by mpw at 02:04:57 PM 18/09/06
-------------------
Bonding Stats: 510 OK / 2 redone / 0 FAIL / 0 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
2 1 3461 0 2 1 OK
2 257 3476 8 2 1 OK
r-side 710 Row 3 Entered by mpw at 02:06:11 PM 18/09/06
-------------------
Bonding Stats: 506 OK / 4 redone / 0 FAIL / 2 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
3 161 3472 5 1 1 OK
3 235 3475 7 41 1 OK
3 236 3475 7 45 1 OK
3 306 3477 9 69 1 OK
3 326 3478 10 21 -2 OK
3 379 3480 11 105 -2 OK
r-side 710 Row 4 Entered by mwhitley at 03:02:56 PM 19/09/06
-------------------
Bonding Stats: 506 OK / 4 redone / 0 FAIL / 2 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
4 5 3461 0 16 1 OK
4 21 3461 0 80 1 OK
4 69 3468 2 16 -2 OK
4 214 3474 6 84 1 OK
4 363 3480 11 40 -2 OK
4 508 3484 15 108 1 OK
Sensor bond complete. Database updated.
Module updated to Stage 23
========================================================================
Module-93 Logfile - STAGE 24
----------------------------
Sensor end bonding (sensor to pitch adaptor) on 710
p-side 710 Row 1 Entered by mwhitley at 03:04:28 PM 19/09/06
-------------------
Bonding Stats: 505 OK / 6 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
1 47 3490 1 59 1 OK
1 53 3490 1 83 1 OK
1 77 3494 2 51 1 OK
1 268 3501 8 47 -2 OK
1 436 3507 13 79 1 OK
1 510 3510 15 119 1 OK
1 511 3510 15 123 1 OK
p-side 710 Row 2 Entered by mwhitley at 03:05:22 PM 19/09/06
-------------------
Bonding Stats: 507 OK / 3 redone / 0 FAIL / 2 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
2 53 3490 1 82 -2 OK
2 56 3490 1 94 1 OK
2 305 3503 9 66 1 OK
2 306 3503 9 70 1 OK
2 363 3505 11 42 -2 OK
p-side 710 Row 3 Entered by mwhitley at 03:06:58 PM 19/09/06
-------------------
Bonding Stats: 501 OK / 8 redone / 0 FAIL / 3 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
3 169 3498 5 33 1 OK
3 180 3498 5 77 1 OK
3 207 3499 6 57 1 OK
3 242 3500 7 69 -2 OK
3 290 3503 9 5 1 OK
3 294 3503 9 21 1 OK
3 296 3503 9 29 1 OK
3 331 3504 10 41 -2 OK
3 367 3505 11 57 1 OK
3 368 3505 11 61 1 OK
3 421 3507 13 17 -2 OK
p-side 710 Row 4 Entered by mwhitley at 03:10:05 PM 19/09/06
-------------------
Bonding Stats: 501 OK / 8 redone / 1 FAIL / 2 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
4 144 3497 4 60 -2 OK
4 200 3499 6 28 1 OK
4 201 3499 6 32 1 OK
4 204 3499 6 44 -1 OK
4 207 3499 6 56 1 OK
4 212 3499 6 76 1 OK
4 215 3499 6 88 1 OK
4 221 3499 6 112 1 OK
4 222 3499 6 116 1 OK
4 242 3500 7 68 -2 OK
4 277 3501 8 80 1 OK
Sensor bond complete. Database updated.
Module updated to Stage 24
========================================================================
Module-93 Logfile - STAGE 24 Entered by huse at 11:21:37 AM 22/09/06
--------------------------
Log IV Measurements:
--------------------
IV measurements after sensor to pitch adaptor bonding
hyb93P_2439-05B_bonded.txt uploaded. Plot Graphic
hyb93R_2440-14E_bonded.txt uploaded. Plot Graphic
IV measurements logged
Authorisation - Entered by gcasse at 09:49:22 AM 26/09/06
-------------
Authorisation given to log Laser test data and glue hybrid to pedestal
Module has been set as PASS
========================================================================
Module-93 Logfile - STAGE 25 Entered by gcasse at 04:10:31 PM 26/09/06
--------------------------
Full Module Test Comment:
----------------------------
The channel list on the R side should add 3 shorts:
1762-1764, 1752-1754, 1760-1762 (at least, we\'ll see with the burn-in test if there are more shorts);
on the phi side, the channels from 127 to 143, labelled as bad, are actually fine.
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
1.294 |
0.196 |
129.467 | 2.349
| | 1 |
1.321 |
0.116 |
133.718 | 2.838
| | 2 |
1.528 |
0.148 |
128.671 | 2.793
| | 3 |
1.382 |
0.112 |
123.592 | 2.533
| | 4 |
1.352 |
0.097 |
127.813 | 2.838
| | 5 |
1.578 |
0.120 |
126.299 | 1.395
| | 6 |
1.493 |
0.121 |
126.040 | 0.992
| | 7 |
1.542 |
0.140 |
128.578 | 2.045
| | 8 |
1.435 |
0.090 |
133.036 | 1.713
| | 9 |
1.545 |
0.125 |
126.666 | 3.302
| | 10 |
1.500 |
0.136 |
132.198 | 1.727
| | 11 |
1.417 |
0.101 |
129.829 | 2.582
| | 12 |
1.251 |
0.078 |
131.412 | 1.137
| | 13 |
1.385 |
0.161 |
129.381 | 1.137
| | 14 |
1.134 |
0.059 |
129.431 | 2.282
| | 15 |
1.256 |
0.091 |
131.811 | 1.427
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.958 |
0.052 |
128.236 | 2.910
| | 1 |
1.000 |
0.062 |
130.404 | 2.140
| | 2 |
1.099 |
0.056 |
129.579 | 2.677
| | 3 |
1.180 |
0.054 |
129.296 | 1.891
| | 4 |
1.133 |
0.068 |
131.091 | 1.787
| | 5 |
1.181 |
0.109 |
128.815 | 1.363
| | 6 |
1.166 |
0.061 |
130.789 | 2.553
| | 7 |
1.272 |
0.075 |
130.366 | 1.573
| | 8 |
1.129 |
0.063 |
129.297 | 2.253
| | 9 |
1.158 |
0.058 |
128.853 | 1.933
| | 10 |
1.100 |
0.057 |
133.345 | 1.004
| | 11 |
1.158 |
0.052 |
129.771 | 1.907
| | 12 |
1.086 |
0.124 |
126.456 | 1.114
| | 13 |
1.040 |
0.100 |
129.126 | 1.784
| | 14 |
0.911 |
0.046 |
130.385 | 1.376
| | 15 |
1.015 |
0.053 |
129.028 | 1.769
|
|
| R chips problem bonds | P side problem bonds |
|---|
| Strip | chip | channel | FEB | SEB | Lflag | LStrip |
|---|
| 1755 |
0 |
91 |
0 |
0 |
-3 |
1755 |
| 1764 |
0 |
100 |
0 |
0 |
-3 |
1764 |
| 1936 |
2 |
16 |
0 |
-2 |
-1 |
1936 |
| 1223 |
7 |
56 |
0 |
0 |
-3 |
1223 |
| 781 |
9 |
13 |
0 |
0 |
-1 |
781 |
| 917 |
10 |
21 |
0 |
-2 |
-3 |
917 |
| 599 |
11 |
40 |
0 |
-2 |
-3 |
599 |
| 534 |
11 |
105 |
0 |
-2 |
-3 |
534 |
| 63 |
12 |
63 |
0 |
-2 |
-1 |
63 |
| 97 |
12 |
97 |
0 |
0 |
-3 |
97 |
| 109 |
12 |
109 |
0 |
0 |
-1 |
109 |
| 401 |
13 |
110 |
0 |
0 |
-2 |
401 |
| 400 |
13 |
111 |
0 |
0 |
-2 |
400 |
| 144 |
15 |
111 |
0 |
0 |
-1 |
144 |
|
| Strip | chip | channel | FEB | SEB | Lflag | LStrip |
|---|
| 1908 |
1 |
82 |
0 |
-2 |
-1 |
1908 |
| 1666 |
4 |
60 |
0 |
-2 |
-1 |
1666 |
| 1598 |
5 |
33 |
0 |
1 |
-3 |
1598 |
| 1506 |
6 |
44 |
0 |
-1 |
0 |
1506 |
| 387 |
6 |
117 |
0 |
0 |
1 |
387 |
| 361 |
7 |
68 |
0 |
-2 |
-2 |
361 |
| 360 |
7 |
69 |
0 |
-2 |
-2 |
360 |
| 1333 |
8 |
47 |
0 |
-2 |
-1 |
1333 |
| 1166 |
10 |
41 |
0 |
-2 |
-1 |
1166 |
| 1081 |
11 |
42 |
0 |
-2 |
-1 |
1081 |
| 143 |
12 |
81 |
0 |
0 |
1 |
143 |
| 142 |
12 |
84 |
0 |
0 |
1 |
142 |
| 141 |
12 |
88 |
0 |
0 |
1 |
141 |
| 139 |
12 |
93 |
0 |
0 |
1 |
139 |
| 138 |
12 |
96 |
0 |
0 |
1 |
138 |
| 137 |
12 |
100 |
0 |
0 |
1 |
137 |
| 136 |
12 |
101 |
0 |
0 |
1 |
136 |
| 135 |
12 |
105 |
0 |
0 |
1 |
135 |
| 134 |
12 |
108 |
0 |
0 |
1 |
134 |
| 131 |
12 |
117 |
0 |
0 |
1 |
131 |
| 130 |
12 |
120 |
0 |
0 |
1 |
130 |
| 127 |
13 |
1 |
0 |
0 |
1 |
127 |
| 926 |
13 |
17 |
0 |
-2 |
-1 |
926 |
|
| Total bad r bonds 14 | Total bad p bonds 23 |
R-side chip/channel 0 91 laser flag -3 set
R-side chip/channel 0 100 laser flag -3 set
P-side chip/channel 1 82 laser flag -1 set
R-side chip/channel 2 16 laser flag -1 set
P-side chip/channel 4 60 laser flag -1 set
P-side chip/channel 5 33 laser flag -3 set
P-side chip/channel 6 117 laser flag 1 set
R-side chip/channel 7 56 laser flag -3 set
P-side chip/channel 7 68 laser flag -2 set
P-side chip/channel 7 69 laser flag -2 set
P-side chip/channel 8 47 laser flag -1 set
R-side chip/channel 9 13 laser flag -1 set
R-side chip/channel 10 21 laser flag -3 set
P-side chip/channel 10 41 laser flag -1 set
R-side chip/channel 11 40 laser flag -3 set
P-side chip/channel 11 42 laser flag -1 set
R-side chip/channel 11 105 laser flag -3 set
R-side chip/channel 12 63 laser flag -1 set
P-side chip/channel 12 81 laser flag 1 set
P-side chip/channel 12 84 laser flag 1 set
P-side chip/channel 12 88 laser flag 1 set
P-side chip/channel 12 93 laser flag 1 set
P-side chip/channel 12 96 laser flag 1 set
R-side chip/channel 12 97 laser flag -3 set
P-side chip/channel 12 100 laser flag 1 set
P-side chip/channel 12 101 laser flag 1 set
P-side chip/channel 12 105 laser flag 1 set
P-side chip/channel 12 108 laser flag 1 set
R-side chip/channel 12 109 laser flag -1 set
P-side chip/channel 12 117 laser flag 1 set
P-side chip/channel 12 120 laser flag 1 set
P-side chip/channel 13 1 laser flag 1 set
P-side chip/channel 13 17 laser flag -1 set
R-side chip/channel 13 110 laser flag -2 set
R-side chip/channel 13 111 laser flag -2 set
R-side chip/channel 15 111 laser flag -1 set
Module updated to Stage 25
========================================================================
Comment - Entered by jlc at 02:38:30 PM 24/10/06
-------
Thickness of hybrid cooling tongue
1) 0.896
2) 0.893
3) 0.890
4) 0.890
5) 0.889
6) 0.885
7) 0.868
8) 0.869
9) 0.866
========================================================================
Module-93 Logfile - STAGE 26 Entered by at 05:43:17 PM 3/11/06
--------------------------
Attached to Pedestal 42
-------------------------------
hybrid 93 attached to pedestal 42 R-glued - DB updated
Add Pedestal Comment:
-------------------
========================================================================
Module-93 Logfile - STAGE 27 Entered by jlc at 03:34:14 PM 10/11/06
--------------------------
Full Module Metrology:
----------------------
Phi_summary.txt uploaded.
Phi_si-plane.txt uploaded.
Phi_hyb-plane.txt uploaded.
R_summary.txt uploaded.
R_si-plane.txt uploaded.
R_hyb-plane.txt uploaded.
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Touch_summary.txt uploaded.
Cooling_face.txt uploaded.
Metrology Analysis
Module updated to Stage 27
========================================================================
Module-93 Logfile - STAGE 28 Entered by at 04:50:13 PM 10/11/06
--------------------------
Attach cables to module
-------------------------------
Cable HT-64 attached to Module 93 r-side - DB updated
Cable LT-64 attached to Module 93 r-side - DB updated
Cable HT-65 attached to Module 93 p-side - DB updated
Cable LT-65 attached to Module 93 p-side - DB updated
========================================================================
Module-93 Logfile - STAGE 29 Entered by jlc at 04:54:05 PM 10/11/06
--------------------------
Full Module Metrology after Cable attachment:
---------------------------------------------
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Metrology Analysis
Module updated to Stage 29
========================================================================
Module-93 Logfile - STAGE 30 Entered by gdp at 03:51:49 PM 15/11/06
--------------------------
Burn-In Test Comment:
----------------------------
Tcenter was -19C and the average Tsilicon was -8.5C
Bad channel lists verified. Many bad channels on R-side (35+3)
Phi side has 10.
| Data | R time | P time |
|---|
| Noise |
081106_1525 | 081106_1524 |
| Noise |
081106_1549 | 081106_1551 |
Module updated to Stage 30
========================================================================
Module-93 Logfile - STAGE 31 Entered by jlc at 04:48:01 PM 15/11/06
--------------------------
Full Module Metrology after Burn-in:
------------------------------------
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Metrology Analysis
Module updated to Stage 31
========================================================================
Comment - Entered by hcroft at 12:51:47 PM 22/11/06
-------
Burnin temps: hybrid -16deg Sensors -9.8deg
========================================================================
Comment - Entered by gdp at 02:44:13 PM 22/11/06
-------
Repairs to problem channels (shorts,opens) were carried out
on R-side and the following channels have been fixed:
Chip Channel SWStrip
0 88 1752
0 90 1754
0 91 1755
0 96 1760
0 98 1762
1 64 1856
1 66 1858
3 2 1661
3 64 1599
3 66 1597
6 124 1283
6 126 1281
9 13 781
12 109 109
15 111 144
This leaves 21 dead + 2 problem channels on the R-side
========================================================================
Comment - Entered by affolder at 12:41:35 PM 23/11/06
-------
R-side prior to shipment
Picture caption: R-side prior to shipment
========================================================================
Comment - Entered by affolder at 12:42:22 PM 23/11/06
-------
Phi-side prior to shipment
Picture caption: Phi-side prior to shipment
========================================================================
Comment - Entered by affolder at 01:46:07 PM 23/11/06
-------
01:45:40 PM 23/11/06
M42-checklist.doc
Module progressed to stage 32. Now complete.
========================================================================
Comment - Entered by affolder at 01:46:56 PM 23/11/06
-------
01:45:40 PM 23/11/06
M42-checklist.doc
Module progressed to stage 32. Now complete.
========================================================================
Comment - Entered by affolder at 01:48:16 PM 23/11/06
-------
Hybrid manually regressed to previous stage.
========================================================================
Comment - Entered by affolder at 01:58:49 PM 23/11/06
-------
01:58:33 PM 23/11/06
M42-checklist.doc
M42_visual_inspection.pdf
Module progressed to stage 32. Now complete.
========================================================================
