module26-R-190806_1106.img
module26-Phi-190806_1104.img
| Module | Hybrid |
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R-glued |
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Module-60 Logfile - STAGE 1 Entered by gdp at 12:01:18 PM 30/01/06
-----------------
Module 60 entry added to data base. Associated with Substrate 19
Thickness Max 0.939 Min 0.897
Deviations A -0.266 / B 0.044 / C -0.157
r-side Hybrid circuit added.
p-side Hybrid circuit added.
Substrate link to module updated.
Visual Inspection Comment:
--------------------------
========================================================================
Module-60 Logfile - STAGE 2 Entered by gdp at 02:25:37 PM 7/02/06
--------------------------
Thickness measurements at chip locations
----------------------------------------
Thickness at chip pos 00 is 1.40
Thickness at chip pos 01 is 1.42
Thickness at chip pos 02 is 1.42
Thickness at chip pos 03 is 1.43
Thickness at chip pos 04 is 1.43
Thickness at chip pos 05 is 1.43
Thickness at chip pos 06 is 1.43
Thickness at chip pos 07 is 1.43
Thickness at chip pos 08 is 1.44
Thickness at chip pos 09 is 1.43
Thickness at chip pos 10 is 1.43
Thickness at chip pos 11 is 1.42
Thickness at chip pos 12 is 1.42
Thickness at chip pos 13 is 1.40
Thickness at chip pos 14 is 1.41
Thickness at chip pos 15 is 1.39
Average of thickness measurements at chip locations 1.420625
========================================================================
Module-60 Logfile - STAGE 3 Entered by gdp at 03:01:22 PM 8/02/06
--------------------------
Phi and R side Metrology data:
-----------------------------
On arrival.
4th corner deviation -0.495
M60_p_height.CSV uploaded. Longitudinal Analysis
M60_r_height.CSV uploaded. Longitudinal Analysis
M60_r_twist.CSV uploaded. Height Analysis
========================================================================
Module-60 Logfile - STAGE 4 Entered by smithy at 05:27:28 PM 6/04/06
--------------------------
Module 60 sent for population updated to Stage 4
========================================================================
Module-60 Logfile - STAGE 5 Entered by geoff at 05:20:56 PM 27/04/06
--------------------------
Comments for hybrid cicuit electrical tests:
Module tested for shorts - non found
Solder on Pads:- pad 1/U1(phi), pad 3/U4 (R), C67 (R)
Electrical test of components PASSED
========================================================================
Module-60 Logfile - STAGE 6 Entered by geoff at 12:26:25 PM 15/05/06
--------------------------
Comments from visual inspection after population:
R Side.
Solder on Vdd pad, chip 2.
Solder on Vss pad Chip 3.
Bond pad damage connector end of chip 8.
Phi Side.
Solder near decoupling capacitor, chip 1.
Solder on corner of base pad, chip 4.
Solder on Vss pad and Vdd pad, chip 5.
Solder on Vdd pad, chip A.
Solder on pad near decoupling capacitor, chip C.
Solder on Vss pad, chip D.
========================================================================
Module-60 Logfile - STAGE 7 Entered by phil at 01:18:11 PM 15/05/06
--------------------------
Phi and R side Metrology data:
-----------------------------
After population.
4th corner deviation -0.442
M60_p_height2.CSV uploaded. Longitudinal Analysis
M60_r_height2.CSV uploaded. Longitudinal Analysis
M60_r_twist2.CSV uploaded. Height Analysis
========================================================================
Authorisation - Entered by smithy at 01:53:30 PM 17/05/06
-------------
Authorisation given to proceed with PA and chip gluing
Module has been set as PASS
========================================================================
Module-60 Logfile - STAGE 8 Entered by affolder at 11:50:14 AM 19/05/06
--------------------------
Following R-type Pitch Adaptors glued
----------------------------------------
PA-102-R1
PA-102-R2
PA-102-R3
PA-94-R4
========================================================================
Module-60 Logfile - STAGE 9 Entered by affolder at 11:50:41 AM 19/05/06
--------------------------
Following P-type Pitch Adaptors glued
----------------------------------------
PA-102-P1
PA-102-P2
PA-85-P3
PA-102-P4
========================================================================
Module-60 Logfile - STAGE 10 Entered by affolder at 10:49:49 AM 22/05/06
---------------------------
Place R-side chips
Chip C-1R2 position 0 on hybrid R-60 updated
Chip C-2R2 position 1 on hybrid R-60 updated
Chip C-3R2 position 2 on hybrid R-60 updated
Chip C-4R2 position 3 on hybrid R-60 updated
Chip C6R2 position 4 on hybrid R-60 updated
Chip C7R2 position 5 on hybrid R-60 updated
Chip C7R3 position 6 on hybrid R-60 updated
Chip C6R3 position 7 on hybrid R-60 updated
Chip C5R3 position 8 on hybrid R-60 updated
Chip C4R3 position 9 on hybrid R-60 updated
Chip C3R3 position 10 on hybrid R-60 updated
Chip C1R3 position 11 on hybrid R-60 updated
Chip C0R3 position 12 on hybrid R-60 updated
Chip C-1R3 position 13 on hybrid R-60 updated
Chip C2R4 position 14 on hybrid R-60 updated
Chip C1R4 position 15 on hybrid R-60 updated
========================================================================
Module-60 Logfile - STAGE 11 Entered by affolder at 03:03:27 PM 22/05/06
---------------------------
Place P-side chips
Chip C6R5 position 0 on hybrid P-60 updated
Chip C5R5 position 1 on hybrid P-60 updated
Chip C4R5 position 2 on hybrid P-60 updated
Chip C-4R6 position 3 on hybrid P-60 updated
Chip C-5R6 position 4 on hybrid P-60 updated
Chip C-5R5 position 5 on hybrid P-60 updated
Chip C-4R5 position 6 on hybrid P-60 updated
Chip C-3R5 position 7 on hybrid P-60 updated
Chip C-2R5 position 8 on hybrid P-60 updated
Chip C-1R5 position 9 on hybrid P-60 updated
Chip C0R5 position 10 on hybrid P-60 updated
Chip C1R5 position 11 on hybrid P-60 updated
Chip C2R5 position 12 on hybrid P-60 updated
Chip C3R5 position 13 on hybrid P-60 updated
Chip C-3R6 position 14 on hybrid P-60 updated
Chip C-2R6 position 15 on hybrid P-60 updated
========================================================================
Module-60 Logfile - STAGE 12 Entered by mpw at 11:13:36 AM 24/05/06
--------------------------
Backend Bond r-side Comment:
----------------------------
Problems with following 4 bond wires:
__________________________________
Bond | Chip | RefNum | Pin Name |
----------------------------------
907 2 140 VddPre
908 2 141 VddaComp
1078 0 203 GndaTx
1079 0 203 GndaTx
========================================================================
Module-60 Logfile - STAGE 13 Entered by mpw at 11:14:24 AM 24/05/06
--------------------------
Backend Bond p-side Comment:
----------------------------
Problems with following 8 bond wires:
__________________________________
Bond | Chip | RefNum | Pin Name |
----------------------------------
1 15 135 VddPre
345 11 3 VddPre
355 10 144 Gndd
421 9 142 VdddComp
480 9 4 VddPre
554 7 140 VddPre
710 5 180 Reset
955 2 3 VddPre
========================================================================
Module-60 Logfile - STAGE 14 Entered by huse at 05:47:17 PM 25/05/06
--------------------------
Electrical Test Comment:
----------------------------
R Chips PASS
Phi Chips PASS
| R chips NOISE PEDESTAL | P chips NOISE PEDESTAL |
|
|
|---|
| R chips NOISE PEDESTAL | P chips NOISE PEDESTAL |
|
|
|---|
| R chips NOISE PEDESTAL | P chips NOISE PEDESTAL |
|
|
|---|
| R chips problem bonds | P side problem bonds | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Total bad r bonds 2 | Total bad p bonds 4 |
========================================================================
Comment - Entered by affolder at 11:34:49 AM 2/08/06
-------
Phi-side chip 0 channels 72 & 73 are shorted due to bond foot on sensor
========================================================================
Comment - Entered by jlc at 01:32:23 PM 7/08/06
-------
Thickness of hybrid cooling tongue
1) 0.920
2) 0.916
3) 0.906
4) 0.939
5) 0.935
6) 0.932
7) 0.898
8) 0.896
9) 0.890
========================================================================
Module-60 Logfile - STAGE 26 Entered by at 03:06:57 PM 10/08/06
--------------------------
Attached to Pedestal 26
-------------------------------
hybrid 60 attached to pedestal 26 R-glued - DB updated
Add Pedestal Comment:
-------------------
========================================================================
Module-60 Logfile - STAGE 27 Entered by jlc at 10:00:00 AM 11/08/06
--------------------------
Full Module Metrology:
----------------------
hyb60-ped26-ass_onJig.txt uploaded.
Phi_summary.txt uploaded.
Phi_si-plane.txt uploaded.
Phi_hyb-plane.txt uploaded.
R_summary.txt uploaded.
R_si-plane.txt uploaded.
R_hyb-plane.txt uploaded.
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Touch_summary.txt uploaded.
Cooling_face.txt uploaded.
Metrology Analysis
Module updated to Stage 27
========================================================================
Comment - Entered by jlc at 10:01:51 AM 11/08/06
-------
Error in files
Hybrid manually regressed to previous stage.
========================================================================
Module-60 Logfile - STAGE 27 Entered by jlc at 10:18:15 AM 11/08/06
--------------------------
Full Module Metrology:
----------------------
Regressed & files uploaded again due to extra tab in data file
hyb60-ped26-ass_onJig.txt uploaded.
Phi_summary.txt uploaded.
Phi_si-plane.txt uploaded.
Phi_hyb-plane.txt uploaded.
R_summary.txt uploaded.
R_si-plane.txt uploaded.
R_hyb-plane.txt uploaded.
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Touch_summary.txt uploaded.
Cooling_face.txt uploaded.
Metrology Analysis
Module updated to Stage 27
========================================================================
Module-60 Logfile - STAGE 28 Entered by at 09:42:03 AM 16/08/06
--------------------------
Attach cables to module
-------------------------------
Add Cable Comment:
-------------------
Cables offset on the r-side (Carbon fibre block added)
Cable HT-18 attached to Module 60 r-side - DB updated
Cable LT-18 attached to Module 60 r-side - DB updated
Cable HT-19 attached to Module 60 p-side - DB updated
Cable LT-19 attached to Module 60 p-side - DB updated
========================================================================
Module-60 Logfile - STAGE 29 Entered by jlc at 02:48:22 PM 17/08/06
--------------------------
Full Module Metrology after Cable attachment:
---------------------------------------------
Base with extension
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Metrology Analysis
Module updated to Stage 29
========================================================================
Comment - Entered by affolder at 02:15:53 PM 21/08/06
-------
Picture of R-side
========================================================================
Comment - Entered by affolder at 02:16:44 PM 21/08/06
-------
Close-up of R-side sensor
========================================================================
Comment - Entered by affolder at 02:17:27 PM 21/08/06
-------
Picture of Phi-side
========================================================================
Comment - Entered by affolder at 02:18:01 PM 21/08/06
-------
Close-up of phi-side sensor
========================================================================
Module-60 Logfile - STAGE 30 Entered by gdp at 05:29:18 PM 22/08/06
--------------------------
Burn-In Test Comment:
----------------------------
Tcenter was -18C and the average Tsilicon was -5.5C
| Data | R time | P time |
|---|---|---|
| Noise | 190806_1204 | 190806_1158 |
| Raw R-side thermograph data. module26-R-190806_1106.img |
|
| Raw P-side thermograph data. module26-Phi-190806_1104.img |
|
========================================================================
Comment - Entered by gdp at 12:44:20 PM 23/08/06
-------
This module taken to CERN by car by TJVB 23/08/2006
Hybrid manually progressed to stage 32.
========================================================================
Comment - Entered by alison at 03:11:38 PM 28/08/06
-------
Visual inspection at cern (Mark and Alison).
Phi side:
Removed loose bond wires on scratch pad.
Low res inspection fine.
Hi-res inspection:
BEB all present and correct.
FEB all fine except first few bonds on chip 0 are squashed
(see picture).
SEB all fine except for some debris on the end of chip 3(see picture) and missing bond on chip 2 (channel 29).
========================================================================
Comment - Entered by alison at 03:15:30 PM 28/08/06
-------
See previous entry.
========================================================================
Comment - Entered by alison at 03:17:31 PM 28/08/06
-------
Unbonded strip on phi side.
Chip 2 channel 29.
========================================================================
Comment - Entered by alison at 04:52:18 PM 28/08/06
-------
Visual inspection - R side (Alison and Mark).
BEB: all OK.
FEB: some rubbish on chip 1 channel ~100 (see picture).
chip 4: confirm melted bond wire vddcomp (see picture).
chip 11: some rubbish on channel 136 
========================================================================
Comment - Entered by alison at 04:55:04 PM 28/08/06
-------
chip 4: confirm melted bond wire vddcomp (see picture).
========================================================================
Comment - Entered by alison at 04:55:50 PM 28/08/06
-------
chip 11: some rubbish on channel 136
========================================================================
Comment - Entered by alison at 04:56:46 PM 28/08/06
-------
SEB: chip 4 debris on silicon
========================================================================
Comment - Entered by alison at 04:58:55 PM 28/08/06
-------
SEB Chip 4: Confirm channel 15 is unbonded
========================================================================
Comment - Entered by alison at 04:59:51 PM 28/08/06
-------
SEB chip 5: see unbonded channel (58).
========================================================================
Comment - Entered by alison at 05:00:37 PM 28/08/06
-------
SEB chip 11: some debris on silicon.
========================================================================
Comment - Entered by gdp at 03:28:30 PM 13/10/06
-------
Module 26 was returned from CERN and re-tested in the burnin
tank. (see elog from Gianluigi). The verified bad channel lists
have been updated with the following:
R-side chip 2 channel 115 flagged as NOISY
P-side chip 1 channel 16 is now flagged OK (was dead before)
chip 2 channel 109 flagged as NOISY
chip 2 channel 110 flagged as NOISY
The extension was removed and the module was recabled as not
extended module. The DB has been updated to reflect this, and
additional metrology measurements with and without the new cables have been logged.
========================================================================
Comment - Entered by affolder at 04:36:08 PM 16/10/06
-------
Picture of damage to surface to chip R4. To me, it looks like the passitivation of the chip has been damaged
and there is discoloration to the surface as well.
Picture caption: Damage to chip surface (Chip R4)
========================================================================
Comment - Entered by affolder at 04:37:33 PM 16/10/06
-------
Picture of the melted wirebond on chip R4. The two neighbors in the direction of the back-end have lifted bonds.
Picture caption: Melted wirebond on chip R4
========================================================================
Comment - Entered by affolder at 04:38:50 PM 16/10/06
-------
Picture of R-side of M26. This is after modification to be un-extended.
Picture caption: M26 r-side (second shipment to CERN)
========================================================================
Comment - Entered by affolder at 04:39:40 PM 16/10/06
-------
M26 phi-side (2nd shipment to CERN)
Picture caption: M26 phi-side (2nd shipment to CERN)
========================================================================
Comment - Entered by affolder at 10:56:44 AM 19/10/06
-------
Here are the results of the visual inspection of chip 4, R-side using the high magnification microscope in the
CERN bonding area.
1) The looping of the wire was caused by the wire bond tool coming down on the bond, and not as I thought
due to heat, etc. With the microscope you can see the tool mark on the side of the wire bond.
So the bonds on M17 were possibly cause by the same thing.
2) Two wire bonds in the comparitor section did lift (GRNDCOMP and GRND) after the visual inspection on
the 1st reception at CERN. The surface discoloration starts at the bond feet at the chip for these two
bonds. It is conceivaible that this is what started the surface discoloratoin seen or the bond could have
lifted due to the effects as well. Beetle experts will be contacted to see if these bonds lifting could
cause increased current/localized heating.
3) The surface discoloration has one of 3 likely sources:
a)Polymide-could be baking on surface
b)Plastic residue-could have had bits seen on hybrid
face on bond wires which melted
c)Other transfer-organics,etc.
4) From pictures, chip circuit does not look damaged; only a surface layer is discolored.
So I believe the chip is ok, surprisingly. I would be more confident in the module if the chip was replaced.
Picture caption: Wide view of surface of chip 4, r-side
========================================================================
Comment - Entered by affolder at 01:47:39 PM 23/10/06
-------
Picture caption: Picture caption: Wide view of surface of chip 4, r-side
========================================================================
Comment - Entered by affolder at 01:49:11 PM 23/10/06
-------
This is a close-up of the stain on the chip. I am not sure if this is a contaimate or if the polymide on the surface
is discolored.
Picture caption: Close-up of stained area near chip
========================================================================
Comment - Entered by affolder at 01:52:12 PM 23/10/06
-------
This is a closer view of the discoloration near the wire bonds. The discoloration start at the two lifted bonds:
GnddComp and Gndd in the comparitor section of the chip.
I am not sure if it is transfer or baked polymide.
Picture caption: Close-up of discolored area near wire bonds
========================================================================
Comment - Entered by affolder at 01:53:40 PM 23/10/06
-------
Further magnification of area near wirebonds.
Wirebonds look \"gazed\" and discolored as well.
Picture caption: Closer-up of discolored area near wire bonds
========================================================================
Comment - Entered by affolder at 01:56:59 PM 23/10/06
-------
Discolored surface seems to be on a bond pad that has not attached wire
(above the VDDD pad in the comparitor section of the chip)
To me, at appears that there is a fracture line in the surface that has been discolored elsewhere
due to a probe pad. This leads me to believe that the polymide is discoloring, but I can't no confirm it.
Picture caption: Close-up of bond pad near discolored area.
========================================================================
Comment - Entered by mwhitley at 11:51:16 AM 19/12/06
-------
Chip 4 on the Radial side has been replaced and re-bonded
Mike Wormald bonded the back end with no problems to report
Mark Whitley bonded the front end
R1=ok
R2=134
R3=ok
R4=ok
========================================================================
Comment - Entered by hcroft at 10:33:37 AM 20/12/06
-------
Hybrid temp -15deg, sensor temp -9.4deg
========================================================================
Comment - Entered by hcroft at 10:34:51 AM 20/12/06
-------
During burnin at least twice the current on the R sensor jumped from around -60microA to +80microA
for a few seconds before going back to -60microA.
========================================================================
Comment - Entered by affolder at 10:11:19 AM 10/01/07
-------
R-side prior to shipment
Picture caption: R-side prior to shipment
========================================================================
Comment - Entered by affolder at 10:11:55 AM 10/01/07
-------
Phi-side prior to shipment
Picture caption: Phi-side prior to shipment
========================================================================
Comment - Entered by affolder at 03:43:04 PM 19/01/07
-------
R-side prior to another shipment
Picture caption: R-side prior to another shipment
========================================================================
Comment - Entered by affolder at 03:43:49 PM 19/01/07
-------
Phi-side prior to another shipment
Picture caption: Phi-side prior to another shipment
========================================================================