LHCb Velo - Module Data for Hybrid p-135
| Module |
Hybrid |
| Circuit |
Pitch Adaptors |
Chips |
Sensor |
|---|
|
5
R-glued |
135
| p-135 |
All ,
P1 |
All ,
0 ,
1 ,
2 ,
3 |
2439-10B |
|
| P2 |
4 ,
5 ,
6 ,
7 |
| P3 |
8 ,
9 ,
10 ,
11 |
| P4 |
12 ,
13 ,
14 ,
15 |
|
|
Go to
Current Hybrid Log Entry
Module-135 Logfile - STAGE 1 Entered by affolder at 11:00:43 AM 14/11/06
-----------------
Module 135 entry added to data base. Associated with Substrate 107
Thickness Max 0.947 Min 0.940
Deviations A -0.115 / B -0.095 / C -0.153
r-side Hybrid circuit added.
p-side Hybrid circuit added.
Substrate link to module updated.
Visual Inspection Comment:
--------------------------
========================================================================
Module-135 Logfile - STAGE 2 Entered by affolder at 12:14:09 PM 14/11/06
--------------------------
Thickness measurements at chip locations
----------------------------------------
Thickness at chip pos 00 is 1.44
Thickness at chip pos 01 is 1.46
Thickness at chip pos 02 is 1.48
Thickness at chip pos 03 is 1.49
Thickness at chip pos 04 is 1.48
Thickness at chip pos 05 is 1.47
Thickness at chip pos 06 is 1.47
Thickness at chip pos 07 is 1.48
Thickness at chip pos 08 is 1.46
Thickness at chip pos 09 is 1.47
Thickness at chip pos 10 is 1.48
Thickness at chip pos 11 is 1.47
Thickness at chip pos 12 is 1.48
Thickness at chip pos 13 is 1.49
Thickness at chip pos 14 is 1.48
Thickness at chip pos 15 is 1.46
Average of thickness measurements at chip locations 1.4725
========================================================================
Module-135 Logfile - STAGE 3 Entered by phil at 12:00:13 PM 15/11/06
--------------------------
Phi and R side Metrology data:
-----------------------------
On arrival.
4th corner deviation .024
M135_p_height.CSV uploaded. Longitudinal Analysis
M135_r_height.CSV uploaded. Longitudinal Analysis
M135_r_twist.CSV uploaded. Height Analysis
========================================================================
Module-135 Logfile - STAGE 4 Entered by affolder at 03:00:39 PM 15/11/06
--------------------------
Module 135 sent for population updated to Stage 4
========================================================================
Module-135 Logfile - STAGE 5 Entered by geoff at 11:12:59 AM 5/12/06
--------------------------
Received after polpulation:
========================================================================
Module-135 Logfile - STAGE 5 Entered by geoff at 04:45:51 PM 7/12/06
--------------------------
Electrical test of components PASSED
========================================================================
Module-135 Logfile - STAGE 6 Entered by affolder at 01:00:20 PM 11/12/06
--------------------------
Comments from visual inspection after population:
Cleaned/inspected AAA
========================================================================
Module-135 Logfile - STAGE 7 Entered by affolder at 01:01:03 PM 11/12/06
--------------------------
Phi and R side Metrology data:
-----------------------------
After population.
4th corner deviation -0.111
M135_p_height2.CSV uploaded. Longitudinal Analysis
M135_r_height2.CSV uploaded. Longitudinal Analysis
M135_r_twist2.CSV uploaded. Height Analysis
========================================================================
Authorisation - Entered by affolder at 01:01:29 PM 11/12/06
-------------
Authorisation given to proceed with PA and chip gluing
Module has been set as PASS
========================================================================
Module-135 Logfile - STAGE 8 Entered by mpw at 03:23:14 PM 23/01/07
--------------------------
Following R-type Pitch Adaptors glued
----------------------------------------
PA-188-R1
PA-125-R2
PA-184-R3
PA-183-R4
========================================================================
Module-135 Logfile - STAGE 9 Entered by mpw at 03:23:39 PM 23/01/07
--------------------------
Following P-type Pitch Adaptors glued
----------------------------------------
PA-187-P1
PA-183-P2
PA-180-P3
PA-182-P4
========================================================================
Module-135 Logfile - STAGE 10 Entered by affolder at 01:05:09 PM 24/01/07
---------------------------
Place R-side chips
Chip C-5R4 position 0 on hybrid R-135 updated
Chip C-4R3 position 1 on hybrid R-135 updated
Chip C-3R3 position 2 on hybrid R-135 updated
Chip C-2R3 position 3 on hybrid R-135 updated
Chip C4R4 position 4 on hybrid R-135 updated
Chip C5R4 position 5 on hybrid R-135 updated
Chip C6R4 position 6 on hybrid R-135 updated
Chip C7R4 position 7 on hybrid R-135 updated
Chip C8R4 position 8 on hybrid R-135 updated
Chip C8R5 position 9 on hybrid R-135 updated
Chip C7R5 position 10 on hybrid R-135 updated
Chip C4R5 position 11 on hybrid R-135 updated
Chip C-5R5 position 12 on hybrid R-135 updated
Chip C-2R5 position 13 on hybrid R-135 updated
Chip C-1R5 position 14 on hybrid R-135 updated
Chip C-3R6 position 15 on hybrid R-135 updated
========================================================================
Module-135 Logfile - STAGE 11 Entered by affolder at 03:41:32 PM 24/01/07
---------------------------
Place P-side chips
Chip C3R2 position 0 on hybrid P-135 updated
Chip C1R2 position 1 on hybrid P-135 updated
Chip C-2R2 position 2 on hybrid P-135 updated
Chip C-3R2 position 3 on hybrid P-135 updated
Chip C6R2 position 4 on hybrid P-135 updated
Chip C5R3 position 5 on hybrid P-135 updated
Chip C-1R3 position 6 on hybrid P-135 updated
Chip C2R4 position 7 on hybrid P-135 updated
Chip C1R4 position 8 on hybrid P-135 updated
Chip C-1R4 position 9 on hybrid P-135 updated
Chip C-2R4 position 10 on hybrid P-135 updated
Chip C-3R4 position 11 on hybrid P-135 updated
Chip C-5R4 position 12 on hybrid P-135 updated
Chip C-3R3 position 13 on hybrid P-135 updated
Chip C5R4 position 14 on hybrid P-135 updated
Chip C6R4 position 15 on hybrid P-135 updated
Comments on P-side chip placement:
========================================================================
Module-135 Logfile - STAGE 12 Entered by mwhitley at 12:25:44 PM 28/01/07
--------------------------
Backend Bond r-side Comment:
----------------------------
No problems
========================================================================
Module-135 Logfile - STAGE 13 Entered by mwhitley at 12:25:58 PM 28/01/07
--------------------------
Backend Bond p-side Comment:
----------------------------
No problems
========================================================================
Module-135 Logfile - STAGE 14 Entered by huse at 06:37:10 PM 28/01/07
--------------------------
Electrical Test Comment:
----------------------------
R Chips PASS
Phi Chips PASS
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.834 |
0.023 |
128.811 | 2.912
| | 1 |
0.885 |
0.035 |
125.426 | 2.507
| | 2 |
0.903 |
0.025 |
131.373 | 2.901
| | 3 |
0.991 |
0.040 |
131.951 | 1.434
| | 4 |
0.824 |
0.018 |
126.873 | 2.284
| | 5 |
0.863 |
0.024 |
129.509 | 1.229
| | 6 |
0.820 |
0.029 |
131.066 | 2.422
| | 7 |
0.915 |
0.039 |
129.208 | 2.583
| | 8 |
0.830 |
0.015 |
129.100 | 3.608
| | 9 |
0.865 |
0.034 |
129.904 | 2.188
| | 10 |
0.858 |
0.016 |
130.136 | 2.511
| | 11 |
0.916 |
0.038 |
128.654 | 1.560
| | 12 |
0.778 |
0.086 |
126.646 | 1.955
| | 13 |
0.763 |
0.083 |
127.529 | 1.734
| | 14 |
0.715 |
0.011 |
131.535 | 1.423
| | 15 |
0.820 |
0.030 |
131.893 | 1.485
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.826 |
0.019 |
126.632 | 1.335
| | 1 |
0.861 |
0.033 |
127.077 | 2.660
| | 2 |
0.876 |
0.024 |
132.157 | 2.006
| | 3 |
0.961 |
0.030 |
130.011 | 3.803
| | 4 |
0.829 |
0.025 |
131.663 | 2.624
| | 5 |
0.884 |
0.027 |
129.134 | 1.543
| | 6 |
0.823 |
0.027 |
128.557 | 2.144
| | 7 |
0.886 |
0.038 |
128.358 | 2.151
| | 8 |
0.820 |
0.012 |
128.339 | 1.297
| | 9 |
0.864 |
0.034 |
129.523 | 2.151
| | 10 |
0.855 |
0.023 |
130.177 | 2.857
| | 11 |
0.952 |
0.044 |
128.096 | 2.175
| | 12 |
0.764 |
0.082 |
129.485 | 3.358
| | 13 |
0.749 |
0.090 |
129.351 | 1.922
| | 14 |
0.709 |
0.012 |
132.569 | 1.312
| | 15 |
0.810 |
0.038 |
132.108 | 2.513
|
|
Module updated to Stage 16
========================================================================
Comment - Entered by huse at 05:29:01 PM 31/01/07
-------
Hard to vac down with R-side down. Should be R-glued.
========================================================================
Comment - Entered by affolder at 04:41:45 PM 7/02/07
-------
Hybrid Tongue Thickness
1) .926
2) .914
3) .906
4) .946
5) .946
6) .924
7) .909
8) .907
9) .901
========================================================================
Comment - Entered by affolder at 04:44:04 PM 7/02/07
-------
CORRECT TONGUE THICKNESS (previous one was for H138)
1) .918
2) .919
3) .913
4) .940
5) .935
6) .927
7) .924
8) .917
9) .911
========================================================================
Comment - Entered by affolder at 05:05:33 PM 7/02/07
-------
CORRECT TONGUE THICKNESS (previous one was for H138)
1) .918
2) .919
3) .913
4) .940
5) .935
6) .927
7) .924
8) .917
9) .911
========================================================================
Module-135 Logfile - STAGE 17
-------------------
Front end bonding (chip to pitch adaptor) on 710
r-side 710 Row 1 Entered by huse at 01:00:47 PM 17/02/07
----------------
Bonding Stats: 509 OK / 3 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
1 25 1471 0 96 1 OK
1 457 1488 14 32 1 OK
1 464 1488 14 60 1 OK
r-side 710 Row 2 Entered by huse at 01:01:29 PM 17/02/07
----------------
Bonding Stats: 511 OK / 1 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
2 25 1471 0 97 1 OK
r-side 710 Row 3 Entered by huse at 01:02:14 PM 17/02/07
----------------
Bonding Stats: 511 OK / 1 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
3 162 1477 5 6 1 OK
r-side 710 Row 4 Entered by mpw at 02:44:39 PM 19/02/07
----------------
\"B\" Machine.
rebonded wires 26 and 168 multiple attempts to bond.
noticed on visual inspection after bonding some wierd bond feet on ~5 channells
Bonding Stats: 508 OK / 4 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
4 1 1471 0 3 1 OK
4 26 1471 0 103 1 OK
4 168 1477 5 31 1 OK
4 218 1478 6 103 1 OK
r-side Front end bond complete. Database updated.
Module updated to Stage 17 complete
========================================================================
Module-135 Logfile - STAGE 18
-------------------
Front end bonding (chip to pitch adaptor) on 710
p-side 710 Row 1 Entered by gsim at 02:47:00 PM 19/02/07
----------------
\"A\" Machine
Bonding Stats: 510 OK / 2 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
1 232 1656 7 28 1 OK
1 497 1669 15 64 1 OK
p-side 710 Row 2 Entered by gsim at 02:48:52 PM 19/02/07
----------------
\"A\" Machine
Bonding Stats: 503 OK / 9 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
2 102 1645 3 21 1 OK
2 141 1647 4 49 1 OK
2 144 1647 4 61 1 OK
2 214 1655 6 85 1 OK
2 225 1656 7 1 1 OK
2 263 1657 8 25 1 OK
2 265 1657 8 33 1 OK
2 294 1659 9 21 1 OK
2 335 1660 10 57 1 OK
p-side 710 Row 3 Entered by mpw at 02:50:10 PM 19/02/07
----------------
\"A\" Machine.
hybrid warped poor vacuum
Bonding Stats: 512 OK / 0 redone / 0 FAIL
p-side 710 Row 4 Entered by mpw at 02:51:02 PM 19/02/07
----------------
\"A\" Machine
poor vacuum
Bonding Stats: 509 OK / 3 redone / 0 FAIL
Row Wire chipID Pos Chan Status DB
4 29 1640 0 115 1 OK
4 131 1647 4 11 1 OK
4 219 1655 6 107 1 OK
p-side Front end bond complete. Database updated.
Module updated to Stage 18 complete
========================================================================
Module-135 Logfile - STAGE 18A Entered by huse at 08:46:26 AM 20/02/07
--------------------------
Electrical Test Comment:
----------------------------
R Chips PASS
Phi Chips PASS
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.851 |
0.022 |
128.718 | 2.958
| | 1 |
0.905 |
0.035 |
125.280 | 2.534
| | 2 |
0.916 |
0.024 |
131.458 | 2.963
| | 3 |
1.003 |
0.038 |
132.144 | 1.434
| | 4 |
0.842 |
0.018 |
126.839 | 2.265
| | 5 |
0.886 |
0.024 |
129.466 | 1.203
| | 6 |
0.831 |
0.029 |
130.961 | 2.353
| | 7 |
0.922 |
0.037 |
129.202 | 2.565
| | 8 |
0.868 |
0.011 |
129.799 | 3.728
| | 9 |
0.902 |
0.025 |
130.619 | 2.005
| | 10 |
0.873 |
0.014 |
130.059 | 2.443
| | 11 |
0.922 |
0.037 |
128.595 | 1.550
| | 12 |
0.796 |
0.089 |
126.817 | 1.947
| | 13 |
0.773 |
0.084 |
127.683 | 1.715
| | 14 |
0.726 |
0.010 |
131.443 | 1.434
| | 15 |
0.819 |
0.028 |
131.789 | 1.485
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
0.823 |
0.020 |
126.663 | 1.195
| | 1 |
0.857 |
0.033 |
126.986 | 2.370
| | 2 |
0.909 |
0.023 |
132.226 | 1.904
| | 3 |
0.984 |
0.031 |
130.141 | 3.709
| | 4 |
0.856 |
0.028 |
131.609 | 2.617
| | 5 |
0.910 |
0.027 |
129.075 | 1.507
| | 6 |
0.842 |
0.029 |
128.552 | 2.106
| | 7 |
0.898 |
0.037 |
128.349 | 2.103
| | 8 |
0.853 |
0.012 |
128.671 | 1.353
| | 9 |
0.899 |
0.029 |
129.886 | 2.059
| | 10 |
0.875 |
0.021 |
130.270 | 2.838
| | 11 |
0.970 |
0.041 |
128.193 | 2.167
| | 12 |
0.788 |
0.086 |
129.685 | 3.298
| | 13 |
0.770 |
0.093 |
129.500 | 1.889
| | 14 |
0.729 |
0.011 |
132.429 | 1.295
| | 15 |
0.827 |
0.041 |
131.939 | 2.463
|
|
Module updated to Stage 18
========================================================================
Authorisation - Entered by affolder at 08:52:43 AM 20/02/07
-------------
Authorisation given to proceed with sensor gluing
Module has been set as PASS
========================================================================
Module-135 Logfile - STAGE 19 Entered by at 10:42:22 AM 20/02/07
--------------------------
Following r-type Sensor glued
-------------------------------
2469-07E attached to hybrid 135 - DB updated
Add Sensor Comment:
-------------------
========================================================================
Module-135 Logfile - STAGE 20 Entered by at 10:43:21 AM 20/02/07
--------------------------
Following p-type Sensor glued
-------------------------------
2439-10B attached to hybrid 135 - DB updated
Add Sensor Comment:
-------------------
========================================================================
Module-135 Logfile - STAGE 21 Entered by huse at 10:20:08 AM 21/02/07
----------------------------
Sensor-sensor Metrology Comment:
--------------------------------
Hyb135P_new.CSV uploaded.
Hyb135R_new.CSV uploaded.
Sensor alignment
Module updated to Stage 21
========================================================================
Module-135 Logfile - STAGE 22 Entered by smithy at 10:53:00 AM 22/02/07
----------------------------
Bias bond & IV Comment:
-----------------------
hyb135P_2439-10B_unbonded.txt uploaded. Plot Graphic
hyb135R_2469-07E_unbonded.txt uploaded. Plot Graphic
Module updated to Stage 22
========================================================================
Module-135 Logfile - STAGE 23
----------------------------
Sensor end bonding (sensor to pitch adaptor) on 710
r-side 710 Row 1 Entered by mwhitley at 12:13:01 PM 23/02/07
-------------------
Bonding Stats: 511 OK / 0 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
1 155 1476 4 107 -2 OK
r-side 710 Row 2 Entered by mwhitley at 12:13:17 PM 23/02/07
-------------------
Bonding Stats: 512 OK / 0 redone / 0 FAIL / 0 SKIP / 0 ERROR
r-side 710 Row 3 Entered by mwhitley at 12:20:32 PM 23/02/07
-------------------
This row was bonded to wire 279 on the A m/c with the
Hesse and Knipps engineer present no bond problems noticed apart from a very slight placement error.
Bonding Stats: 511 OK / 0 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
3 321 1482 10 1 -2 OK
r-side 710 Row 4 Entered by mwhitley at 12:21:26 PM 23/02/07
-------------------
Bonding Stats: 509 OK / 2 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
4 200 1478 6 28 1 OK
4 202 1478 6 36 1 OK
4 290 1481 9 4 -2 OK
Sensor bond complete. Database updated.
Module updated to Stage 23
========================================================================
Module-135 Logfile - STAGE 24
----------------------------
Sensor end bonding (sensor to pitch adaptor) on 710
p-side 710 Row 1 Entered by mwhitley at 12:22:07 PM 23/02/07
-------------------
Bonding Stats: 510 OK / 0 redone / 0 FAIL / 2 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
1 235 1656 7 43 -2 OK
1 301 1659 9 51 -2 OK
p-side 710 Row 2 Entered by mwhitley at 12:22:33 PM 23/02/07
-------------------
Bonding Stats: 511 OK / 0 redone / 0 FAIL / 1 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
2 1 1640 0 2 1 OK (Added by Girish DB updated)
2 217 1655 6 98 -2 OK
p-side 710 Row 3 Entered by mwhitley at 12:23:40 PM 23/02/07
-------------------
Bonding Stats: 507 OK / 1 redone / 0 FAIL / 4 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
3 1 1640 0 1 1 OK
3 92 1644 2 109 -2 OK
3 179 1650 5 73 -2 OK
3 195 1655 6 9 -2 OK
3 239 1656 7 57 -2 OK
p-side 710 Row 4 Entered by mwhitley at 12:24:19 PM 23/02/07
-------------------
Bonding Stats: 509 OK / 0 redone / 0 FAIL / 3 SKIP / 0 ERROR
Row Wire chipID Pos Chan Status DB
4 31 1640 0 120 -2 OK
4 245 1656 7 80 -2 OK
4 310 1659 9 84 -2 OK
Sensor bond complete. Database updated.
Module updated to Stage 24
========================================================================
Module-135 Logfile - STAGE 24 Entered by huse at 05:58:08 PM 24/02/07
--------------------------
Log IV Measurements:
--------------------
IV measurements after sensor to pitch adaptor bonding
hyb135P_2439-10B_bonded.txt uploaded. Plot Graphic
hyb135R_2469-07E_bonded.txt uploaded. Plot Graphic
IV measurements logged
Authorisation - Entered by affolder at 10:21:14 AM 26/02/07
-------------
Authorisation given to log Laser test data and glue hybrid to pedestal
Results of visual inspection:
Bad channels not found by laser:
Phi-side:
Chip 0
Channel 2 lift chip-PA. Removed
Chip 9
Channels 103 & 126 chip-PA bond damaged while removing
nearby popped bond. Both removed. As this happened
after the laser test, the two open do NOT show in
laser data
Unexpected bad channels found by laser:
R-side:
Chip 0
Channel 92 open chip-PA. Too hard to remove
Phi-side:
Chip 9
Channel 2 & 14 open chip side of chip-PA bond. Both
wires removed
Good channels marked by laser:
R-side:
Chip 0
Channel 31 missing laser file. OK.
Chip 2
Channel 31 missing laser file. OK.
Chip 9
Channel 5 low laser. OK.
Chip 12
Channel 31 missing laser file. OK.
Chip 15
Channel 50 low laser. OK.
Phi-side:
Chip 10
Channel 61 slightly low laser. OK.
Chip 14
Channel 84 wide laser. OK.
Total bad channels: 4 R, 16 phi
Module has been set as PASS
========================================================================
Authorisation - Entered by affolder at 10:21:30 AM 26/02/07
-------------
Authorisation given to log Laser test data and glue hybrid to pedestal
Module has been set as PASS
========================================================================
Module-135 Logfile - STAGE 25 Entered by affolder at 10:22:13 AM 26/02/07
--------------------------
Full Module Test Comment:
----------------------------
| R chips NOISE
PEDESTAL |
| P chips NOISE
PEDESTAL |
|---|
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
1.344 |
0.079 |
128.965 | 2.824
| | 1 |
1.501 |
0.131 |
125.582 | 2.523
| | 2 |
1.579 |
0.117 |
132.428 | 3.058
| | 3 |
1.532 |
0.092 |
132.516 | 1.398
| | 4 |
1.327 |
0.077 |
127.047 | 2.207
| | 5 |
1.537 |
0.102 |
129.933 | 1.479
| | 6 |
1.394 |
0.095 |
130.987 | 2.457
| | 7 |
1.457 |
0.106 |
129.142 | 2.749
| | 8 |
1.373 |
0.081 |
129.102 | 3.668
| | 9 |
1.469 |
0.145 |
129.830 | 2.288
| | 10 |
1.507 |
0.091 |
130.264 | 2.646
| | 11 |
1.411 |
0.092 |
128.421 | 1.544
| | 12 |
1.227 |
0.104 |
126.474 | 1.771
| | 13 |
1.333 |
0.179 |
127.789 | 1.890
| | 14 |
1.195 |
0.054 |
131.939 | 1.388
| | 15 |
1.288 |
0.089 |
132.026 | 1.504
|
| |
| Chips
| Average | RMS |
Average | RMS |
|---|
| 0 |
1.136 |
0.081 |
126.724 | 1.245
| | 1 |
1.185 |
0.087 |
127.087 | 2.540
| | 2 |
1.219 |
0.078 |
132.369 | 1.995
| | 3 |
1.300 |
0.074 |
130.318 | 3.755
| | 4 |
1.174 |
0.079 |
131.733 | 2.600
| | 5 |
1.218 |
0.077 |
129.253 | 1.509
| | 6 |
1.129 |
0.082 |
128.783 | 2.118
| | 7 |
1.179 |
0.085 |
128.536 | 2.115
| | 8 |
1.151 |
0.068 |
128.402 | 1.251
| | 9 |
1.178 |
0.093 |
129.594 | 2.138
| | 10 |
1.184 |
0.075 |
130.276 | 2.831
| | 11 |
1.266 |
0.082 |
128.189 | 2.136
| | 12 |
1.066 |
0.144 |
129.583 | 3.339
| | 13 |
1.020 |
0.136 |
129.508 | 1.931
| | 14 |
0.976 |
0.056 |
132.632 | 1.287
| | 15 |
1.063 |
0.068 |
132.190 | 2.455
|
|
| R chips problem bonds | P side problem bonds |
|---|
| Strip | chip | channel | FEB | SEB | Lflag | LStrip |
|---|
| 1695 |
0 |
31 |
0 |
0 |
-8 |
1695 |
| 1756 |
0 |
92 |
0 |
0 |
-3 |
1756 |
| 1951 |
2 |
31 |
0 |
0 |
-8 |
1951 |
| 1131 |
4 |
107 |
0 |
-2 |
-3 |
1131 |
| 772 |
9 |
4 |
0 |
-2 |
-2 |
772 |
| 773 |
9 |
5 |
0 |
0 |
-2 |
773 |
| 897 |
10 |
1 |
0 |
-2 |
-1 |
897 |
| 31 |
12 |
31 |
0 |
0 |
-8 |
31 |
| 205 |
15 |
50 |
0 |
0 |
-3 |
205 |
|
| Strip | chip | channel | FEB | SEB | Lflag | LStrip |
|---|
| 1975 |
0 |
110 |
0 |
0 |
-1 |
1975 |
| 642 |
0 |
120 |
0 |
-2 |
-1 |
642 |
| 560 |
2 |
109 |
0 |
-2 |
-1 |
560 |
| 444 |
5 |
73 |
0 |
-2 |
-1 |
444 |
| 423 |
6 |
9 |
0 |
-2 |
-1 |
423 |
| 1471 |
6 |
98 |
0 |
-2 |
-1 |
1471 |
| 1421 |
7 |
43 |
0 |
-2 |
-1 |
1421 |
| 364 |
7 |
57 |
0 |
-2 |
-1 |
364 |
| 357 |
7 |
80 |
0 |
-2 |
-1 |
357 |
| 1279 |
9 |
2 |
0 |
0 |
-1 |
1279 |
| 1271 |
9 |
14 |
0 |
0 |
-1 |
1271 |
| 1245 |
9 |
51 |
0 |
-2 |
-1 |
1245 |
| 270 |
9 |
84 |
0 |
-2 |
-3 |
270 |
| 235 |
10 |
61 |
0 |
0 |
-3 |
235 |
| 57 |
14 |
84 |
0 |
0 |
-3 |
57 |
|
| Total bad r bonds 9 | Total bad p bonds 15 |
R-side chip/channel 0 31 laser flag -8 set
R-side chip/channel 0 92 laser flag -3 set
P-side chip/channel 0 110 laser flag -1 set
P-side chip/channel 0 120 laser flag -1 set
R-side chip/channel 2 31 laser flag -8 set
P-side chip/channel 2 109 laser flag -1 set
R-side chip/channel 4 107 laser flag -3 set
P-side chip/channel 5 73 laser flag -1 set
P-side chip/channel 6 9 laser flag -1 set
P-side chip/channel 6 98 laser flag -1 set
P-side chip/channel 7 43 laser flag -1 set
P-side chip/channel 7 57 laser flag -1 set
P-side chip/channel 7 80 laser flag -1 set
P-side chip/channel 9 2 laser flag -1 set
R-side chip/channel 9 4 laser flag -2 set
R-side chip/channel 9 5 laser flag -2 set
P-side chip/channel 9 14 laser flag -1 set
P-side chip/channel 9 51 laser flag -1 set
P-side chip/channel 9 84 laser flag -3 set
R-side chip/channel 10 1 laser flag -1 set
P-side chip/channel 10 61 laser flag -3 set
R-side chip/channel 12 31 laser flag -8 set
P-side chip/channel 14 84 laser flag -3 set
R-side chip/channel 15 50 laser flag -3 set
Module updated to Stage 25
========================================================================
Module-135 Logfile - STAGE 26 Entered by at 10:59:01 AM 26/02/07
--------------------------
Attached to Pedestal 5
-------------------------------
hybrid 135 attached to pedestal 5 R-glued - DB updated
Add Pedestal Comment:
-------------------
========================================================================
Module-135 Logfile - STAGE 27 Entered by peter at 02:47:24 PM 27/02/07
--------------------------
Full Module Metrology:
----------------------
1st full metrology of module 5
Phi_summary.txt uploaded.
Phi_si-plane.txt uploaded.
Phi_hyb-plane.txt uploaded.
R_summary.txt uploaded.
R_si-plane.txt uploaded.
R_hyb-plane.txt uploaded.
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Touch_summary.txt uploaded.
Cooling_face.txt uploaded.
Metrology Analysis
Module updated to Stage 27
========================================================================
Module-135 Logfile - STAGE 28 Entered by at 10:46:10 AM 28/02/07
--------------------------
Attach cables to module
-------------------------------
Cable HT-88 attached to Module 135 r-side - DB updated
Cable LT-88 attached to Module 135 r-side - DB updated
Cable HT-91 attached to Module 135 p-side - DB updated
Cable LT-92 attached to Module 135 p-side - DB updated
========================================================================
Module-135 Logfile - STAGE 29 Entered by peter at 11:39:53 AM 28/02/07
--------------------------
Full Module Metrology after Cable attachment:
---------------------------------------------
top metrology after cables
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Metrology Analysis
Module updated to Stage 29
========================================================================
Comment - Entered by affolder at 03:21:04 PM 28/02/07
-------
R-side prior to shipment
Picture caption: R-side prior to shipment
========================================================================
Comment - Entered by affolder at 03:21:38 PM 28/02/07
-------
Phi-side prior to shipment
Picture caption: Phi-side prior to shipment
========================================================================
Module-135 Logfile - STAGE 30 Entered by gdp at 04:53:19 PM 28/02/07
--------------------------
Burn-In Test Comment:
----------------------------
Tcenter was -18C and the average Tsilicon was -8.5C
Bad channel lists verified.
Total problem R channels 4 (4 dead / 0 problematic)
Total problem P channels 16 (16 dead / 0 problematic)
| Data | R time | P time |
|---|
| Noise |
280207_1409 | 280207_1408 |
Module updated to Stage 30
========================================================================
Module-135 Logfile - STAGE 31 Entered by peter at 04:57:24 PM 28/02/07
--------------------------
Full Module Metrology after Burn-in:
------------------------------------
final top metrology of module 5
Top_summary.txt uploaded.
Top_Phi.txt uploaded.
Top_R.txt uploaded.
Metrology Analysis
Module updated to Stage 31
========================================================================
Comment - Entered by affolder at 05:02:04 PM 28/02/07
-------
05:01:49 PM 28/02/07
M5-checklist.doc
M5_visual_inspection.jpg
Module progressed to stage 32. Now complete.
========================================================================
