LHCb Velo - Chip data for Module 93, Hybrid p-93
Position
Chip type
Wafer ID
Chip Number
Problem Backend Bonds
Wire
RefNo
Pin Name
Problem FE Bonds
Fault
Channel
swstrip
Problem SE Bonds
Fault
Channel
swstrip
Bare
Noise
FEB
Noise
SEB
Noise
0
1.5
DKLJ9DT
C-3R5S6
0
0
0
1
1.5
DKLJ9DT
C-1R5S6
1005
207
Vdda
1006
208
Icurrbuf
1007
209
Isf
1
59
1923
-2
82
1908
1
83
1907
1
94
1900
1
1
1
2
1.5
DKLJ9DT
C3R5S6
1
51
1843
2
2
2
3
1.5
DKLJ9DT
C-3R6S6
3
3
3
4
1.5
DKLJ9DT
C-1R6S6
-2
60
1666
4
4
4
5
1.5
DKLJ9DT
C0R6S6
1
33
1598
1
77
443
5
5
5
6
1.5
DKLJ9DT
C1R6S6
1
28
417
1
32
1514
-1
44
1506
1
56
1498
1
57
407
1
76
401
1
88
397
1
112
389
1
116
1458
6
6
6
7
1.5
DKLJ9DT
C2R6S6
-2
68
361
-2
69
360
7
7
7
8
1.5
DKLJ9DT
C3R6S6
-2
47
1333
1
80
314
8
8
8
9
1.5
DKLJ9DT
C5R6S6
1
5
296
1
21
291
1
29
288
1
66
1236
1
70
1233
9
9
9
10
1.5
DKLJ9DT
C6R6S6
1
38
1169
-2
41
1166
10
10
10
11
1.5
DKLJ9DT
C7R6S6
-2
42
1081
1
57
1070
1
61
192
11
11
11
12
1.5
DKLJ9DT
C-1R7S6
12
12
12
13
1.5
DKLJ9DT
C0R7S6
-2
17
926
1
79
885
13
13
13
14
1.5
DKLJ9DT
C2R7S6
14
14
14
15
1.5
DKLJ9DT
C3R7S6
51
206
VddaTx
1
119
688
1
123
685
15
15
15