LHCb Velo - Module 72 Data

Module     72 Export Document: M72-checklist.doc
Base 72Visual Inspection M72_visual_inspection.jpg
Paddle B126
Hybrid 120 R-glued
Pitch
Adaptors		ChipsSensor V_dep
Volts		Last
IV		HT
cable		LT
cable
R-side PAs    Chips 2469-03E 50 IV    HT-54   LT-7
P-side PAs    Chips 2395-32A 60 IV    HT-79   LT-78

Chip noise data

Bare Chip Front End Bond Sensor End Bond Burn-in Bad Strips
Noise Results
Plots (eps/png)
R-side P-side		 Noise Results
Plots (eps/png)
R-side P-side		 Noise Results
Plots (eps/png)
R-side P-side
  Data   R time plotsP time plots
Noise Results
 150207_1414 150207_1416
Verified Lists

Pedestal Comments

Action:                        Comment:
Manufacture-0.002mm  
MET1bed 72 before grinding  Pedestal Metrology
CommentHyb115 is 960/2=480, 480+220 wire dia.= 700 target  
CommentHyb120 is 960/2=480, 480+220 wire dia.= 700 target  
CommentTarget 700 - 429 Met1 = 271, Plus 4 extra= 275 to grind off  
MET2ped 72 after grinding  Pedestal Metrology

Module Metrology

These text files are tab delimited and it should be possible to import them into Excel.
First Module Metrology:       Analyse Data       Sensor Alignment

Phi_summary.txt
Phi_si-plane.txt
Phi_hyb-plane.txt
R_summary.txt
R_si-plane.txt
R_hyb-plane.txt
Top_summary.txt
Top_Phi.txt
Top_R.txt
Touch_summary.txt
Cooling_face.txt
CERN Metrology:       Analyse Data

P_si-plane.txt
R_si-plane.txt
Second Module Metrology after Cable attachment:       Analyse Data

Top_summary.txt
Top_Phi.txt
Top_R.txt
Final Module Metrology after Burn-in       Analyse Data

Top_summary.txt
Top_Phi.txt
Top_R.txt